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This week, at the 2026 IEEE Electronic Components and Technology Conference (ECTC), imec, a world-leading research and innovation hub in advanced semiconductor technologies, and EV Group (EVG), leading provider of semiconductor manufacturing equipment and process solutions, present a robust and highly yielding wafer-to-wafer hybrid bonding technology at 200nm Cu interconnect pad pitch, demonstrated on a test vehicle with routable interconnects.

Imec Expands Global Footprint of imec.ventures with a Dedicated US Presence

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SEMI Europe Recognizes Tyndall and imec for Their Contributions to the Semiconductor Industry

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SEMI Europe announced the winners of the SEMI European Award 2025 and Special Service Award at the SEMI Industry Strategy Symposium Europe (ISS Europe) 2026 in Sopot, Poland.

Imec Launches University Consortium Around Next Generation of Chips

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