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Advanced Electronics Packaging Digest

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Suggested Items

All Flex Expands Reach Through Flex Interconnect Technologies Acquisition

08/19/2026 | Marcy LaRont, I-Connect007
A strategic partnership between Minnesota-based All Flex Solutions and Flex Interconnect Technologies (FIT) will provide value-added engineering and quick-turn, prototype flexible PCB manufacturing with All Flex’s high-volume flex fabrication. The new alliance offers customers a more comprehensive flex solution and an opportunity to streamline their flex PCB supply chain. All Flex CEO John Fallon discusses the strategic rationale behind the partnership, the benefits of having a “100-year plan,” and how the combined organization is positioning itself for optimum growth.

MKS Earns Zhen Ding 2026 Awards for Service and Innovation

08/18/2026 | Globe Newswire
MKS Inc., a global provider of technologies that transform our world, announced it has received two distinguished contribution awards for 2026 from Zhen Ding Technology Group, a leading printed circuit board and package substrate manufacturer.

TTM Technologies to Acquire Epiq Solutions to Expand Advanced Technology Offerings

08/17/2026 | Globe Newswire
This acquisition reinforces TTM’s Strategy to Drive Long-Term Sustainable Results for Shareholders. TTM continues to balance its portfolio with investments for growth in fast growing markets.

Micron Ventures Launches $250 Million Fund to Invest in the Next Generation of AI

08/14/2026 | Micron
Micron Technology, Inc. launched the Micron Ventures Paradigm Fund, a $250 million investment vehicle built to partner with the companies shaping the future of AI.

Koh Young Technology to Double Production Capacity as AI Server and Advanced Semiconductor Demand Grows

08/12/2026 | Koh Young
Koh Young Technology, the industry leader in True 3D measurement-based inspection solutions, announced plans to expand its Yeoju production complex in Gyeonggi Province, Korea, with the construction of a second production center.
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