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Advanced Electronics Packaging Digest

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Stay ahead of the technologies shaping the future of electronics with our latest newsletter, Advanced Electronics Packaging Digest. Get expert insights on advanced packaging, materials, and system-level innovation, delivered straight to your inbox.

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Suggested Items

Flex to Acquire EPC Power

09/09/2026 | Flex
Flex announced that it has entered into a definitive agreement to acquire EPC Power at a value of $4.4 billion, subject to customary adjustments.

Sivers Invests $30 Million to Expand European Photonics Manufacturing for AI Datacenters

09/03/2026 | Sivers Semiconductors AB
Sivers Semiconductors AB announced a USD 30 million strategic investment to significantly expand its Indium Phosphide (InP) manufacturing facility in Glasgow, Scotland, as the company prepares for anticipated customer production ramps driven by growing AI datacenter and optical networking demand.

Micro-robot Exoskeletons With Rigid-flex PCBs

09/03/2026 | Anaya Vardya, American Standard Circuits
Building a robot the size of a cockroach requires rethinking every assumption of conventional mechanical and electrical engineering. At the centimeter scale, wire harnesses become unmanageable tangles, rigid chassis structures become disproportionately heavy, and conventional connectors dwarf the components they're meant to join. Rigid-flex PCBs offer a radical solution: Make the circuit board the skeleton.

August I-Connect007 Magazine: The Electronics Ecosystem From Design to Development

08/18/2026 | I-Connect007 Editorial Team
This issue of I-Connect007 Magazine examines how collaboration across the electronics ecosystem—from design through fabrication, packaging, AI infrastructure, and flexible circuits—drives innovation and manufacturable products. Our contributors explore co-design from multiple perspectives, using analogies from the forest to the Olympics. We also revisit VeCS for high layer count HDI PCB fabrication, plating challenges for advanced packaging, new applications for flex circuits in robots, and how the U.S. national defense policy could affect PCB sourcing.

Marcy’s Musings: The Power of the Electronics Ecosystem

08/19/2026 | Marcy LaRont -- Column: Marcy's Musings
Electronics hardware product design and manufacturing is a completely interconnected (pun intended) and interdependent system. Success depends on every part of the ecosystem functioning together, a reality that once seemed easy to ignore or sideline, but today, few have the time or resources to work independently.
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