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PCB Technologies to Exhibit at PCB East 2026

04/23/2026 | PCB Technologies Ltd.
Issey Ende, PCB-Technolgies’ VP of Sales and Marketinghas announced that his company will be exhibiting at this year’s PCB East 2026, the premier East Coast conference and exhibition for the electronics design, fabrication, and assembly industry on Wednesday, April 29, 2026, at the DCU Convention Center in Worcester, Massachusetts.

Changing Times: Siemens Plans to Sell Former Mentor Graphics Wilsonville Campus

04/22/2026 | Nolan Johnson, I-Connect007
Siemens announced it will be selling its Wilsonville, Oregon, property, which has served as the campus for Mentor Graphics, which was later acquired by German EDA-giant Siemens, as reported by The Oregonian on April 20. Siemens will maintain one building on the sprawling 53-acre campus, citing the move to hybrid and remote work over the past few years as a key factor in the decision.

Siemens Collaborates with TSMC to Advance AI for Semiconductor Design

04/22/2026 | Siemens
Siemens announced the continuation of collaboration with TSMC to drive innovation in AI-powered automation and advanced semiconductor design enablement.

Standardization, Workforce, and the Road Ahead for Flex–Packaging Integration, Part 3

04/22/2026 | Anaya Vardya, American Standard Circuits
Parts 1 and 2 of this series established the technical foundation and application landscape for the convergence of flexible PCBs and advanced semiconductor packaging. Part 3 addresses what comes next: the standards frameworks, talent pipelines, and strategic imperatives that will determine whether the industry can scale this convergence reliably and competitively.

ACCM Unveils Negative and Near-zero CTE Materials for Large-Format AI Chips

04/21/2026 | Advanced Chip and Circuit Materials
Advanced Chip and Circuit Materials, Inc. (ACCM) has launched two new materials: Celeritas HM50, with a negative coefficient of thermal expansion (CTE) of -8 ppm/°C to offset the positive CTE and expansion of copper with temperature on circuit boards, and Celeritas HM001, with near-zero CTE and the low-loss performance needed for high-speed signal layers to 224 Gb/s and faster in artificial intelligence (AI) circuits.
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