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Beyond the Rulebook
What happens when the rule book is no longer useful, or worse, was never written in the first place? In today’s fast-moving electronics landscape, we’re increasingly asked to design and build what has no precedent, no proven path, and no tidy checklist to follow. This is where “Design for Invention” begins.
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From the growing role of AI in design tools to the challenge of managing cumulative tolerances, these articles in this issue examine the technical details, design choices, and manufacturing considerations that determine whether a board works as intended.
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I-Connect007 Magazine previews APEX EXPO 2026, covering everything from the show floor to the technical conference. For PCB designers, we move past the dreaded auto-router and spotlight AI design tools that actually matter.
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Electronics Trade in a Persistent Tariff Environment
February 24, 2026 | Thiago Guimaraes, Global Electronics AssociationEstimated reading time: 1 minute
Tariffs affecting the electronics sector were largely still in place at the end of 2025, even as the pace of new announcements slowed, and several electronics-relevant investigations and legal questions pushed key decisions into 2026. For companies operating global electronics supply chains, tariffs are no longer a short-term disruption; they are part of the operating environment.
The costs facing electronics manufacturers are no longer limited to the tariff rates we see in headlines. Changes to de minimis rules, stricter enforcement of trade agreements, logistics-related fees, and actions affecting key inputs such as semiconductors and copper, now influence costs, lead times, and sourcing decisions just as much as product-level tariffs. In many cases, these measures act like tariffs even when they are not labeled as such.
Mexico and Canada: Tariffs Take a Back Seat to USMCA Friction
From a North American electronics perspective, tariffs were not the dominant constraint shaping cross-border activity at the end of 2025. While targeted tariffs on non-U.S. Mexico-Canada Agreement (USMCA) goods remained in force for both Mexico and Canada, the more consequential friction increasingly arose from how USMCA rules are interpreted, enforced, and audited in practice.
For electronics manufacturers operating highly integrated production networks across the United States, Mexico, and Canada, compliance complexity (i.e., product classification, documentation, and origin verification) often functioned as a tariff equivalent. These frictions add cost, delay shipments, and increase uncertainty even when nominal tariff rates are unchanged. In Mexico’s case, the coexistence of zero-rated measures alongside targeted non-USMCA tariffs further underscores that policy execution, not tariff escalation, is the primary risk vector.
Looking ahead, the North American electronics ecosystem enters 2026 with relatively stable tariff rates but continued exposure to enforcement-driven volatility make predictability and regulatory alignment as important as formal trade policy.
To continue reading this article, which originally appeared in the February 2026 edition of SMT007 Magazine, click here.
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Koh Young Technology Brings Proven 3D Metrology Expertise to the Advanced Packaging Stage at ECTC 2026
04/21/2026 | Koh Young AmericaKoh Young, the industry leader in True3D™ measurement-based inspection solutions, is bringing its battle-tested platform to where that challenge is being solved at the 2026 IEEE Electronic Components and Technology Conference (ECTC), May 26–29, at the JW Marriott & The Ritz-Carlton Grande Lakes in Orlando, Florida. The advanced packaging industry is demanding a level of inspection precision that traditional metrology simply cannot deliver, and Koh Young is ready to meet that moment.
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Volatile Metals Market Creates PCB Pricing Headache
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AGC's Advanced PCB Material Solutions
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