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Beyond the Rulebook
What happens when the rule book is no longer useful, or worse, was never written in the first place? In today’s fast-moving electronics landscape, we’re increasingly asked to design and build what has no precedent, no proven path, and no tidy checklist to follow. This is where “Design for Invention” begins.
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From the growing role of AI in design tools to the challenge of managing cumulative tolerances, these articles in this issue examine the technical details, design choices, and manufacturing considerations that determine whether a board works as intended.
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I-Connect007 Magazine previews APEX EXPO 2026, covering everything from the show floor to the technical conference. For PCB designers, we move past the dreaded auto-router and spotlight AI design tools that actually matter.
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Keiron Printing Technologies Appoints BarTron as Midwest & Ohio Valley Sales Rep
January 29, 2026 | Keiron Printing TechnologiesEstimated reading time: 2 minutes
Keiron Printing Technologies, a global innovator in advanced electronics manufacturing solutions, announced that it has appointed BarTron, Inc. as its authorized sales representative for Michigan, Ohio, Western Pennsylvania, Indiana, and Kentucky. BarTron will support the introduction and regional adoption of Keiron’s LiFT (Laser-Induced Forward Transfer) technology, including the company’s latest innovation, the Keiron HF2 LiFT Printer.
Founded in July 1989, BarTron, Inc. has built a strong reputation for helping manufacturers solve complex process and production challenges. Through close collaboration with customers and technology partners, BarTron plays a key role in evaluating, implementing, and supporting advanced manufacturing solutions across the electronics assembly industry.
Keiron’s LiFT technology replaces traditional stencil- and nozzle-based solder paste deposition with a laser-driven, non-contact digital process. By eliminating stencils, nozzles, ejectors, and other mechanical contact points, LiFT removes a major source of variability in the SMT process while directly addressing one of the leading causes of assembly defects: inconsistent solder paste application.
The HF2 LiFT Printer enables precise, repeatable solder paste deposition down to nanoliter volumes while working with standard solder pastes and accepting common CAD, Gerber, and ODB++ files. This allows manufacturers to adopt digital solder paste printing without changing materials or reworking existing workflows. With no stencils to fabricate, clean, or store, changeovers can be completed in minutes rather than hours—making the system well suited for high-mix and NPI-driven production environments.
A key differentiator of the HF2 printer is its integrated Solder Paste Volume Metrology (SPVM), which measures every deposit during the printing process. This built-in verification improves first-pass yield while reducing rework and scrap, without the need for a separate SPI system. The contactless architecture also eliminates common reliability issues associated with clogging, wear, and alignment drift found in traditional printing technologies.
“BarTron’s technical depth and customer-focused approach make them an ideal partner as we expand access to LiFT technology,” said Brian Duffey, President of Keiron Technologies USA. “Their ability to guide manufacturers through evaluation and adoption will be instrumental in bringing the HF2 printer into production environments across the region.”
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Julia McCaffrey - NCAB GroupSuggested Items
BGA Technology Expands Inspection Capabilities with Creative Electron TruView X-ray System
05/08/2026 | BGA TechnologyBGA Technology, a leading provider of advanced electronics testing and inspection services, has enhanced its inspection capabilities with the addition of a Creative Electron TruView™ Simplex X-ray system at its Holbrook, New York facility.
AQUANOX A4727 and A4625 Lead KYZEN Offerings at SMTA Oregon Expo and Tech Forum
05/06/2026 | KYZENKYZEN, the global leader in innovative environmentally responsible cleaning chemistries, will exhibit at the SMTA Oregon Expo and Tech Forum scheduled to take place Thursday, May 19 at the Wingspan Event and Conference Center in Hillsboro, Oregon.
Connect the Dots: Designing for the Future of Manufacturing Reality—Surface Finish
05/07/2026 | Matt Stevenson -- Column: Connect the DotsWhen designing the complex boards that many electronic devices require to operate, designers should consider manufacturability at every step. This is my last article focused on designing for the always-evolving manufacturing reality. Choosing the right surface finish has always been important. If you are creating intricate designs with a wide variety of components, like for an ultra-high density interconnect (UHDI) board, surface finish is a critical last step.
Indium to Showcase High-Performance AI Application Solutions at SEMICON SEA 2026
05/01/2026 | Indium CorporationAs a leading provider of advanced materials solutions for today’s demanding AI applications, Indium Corporation® will feature its high-reliability product portfolio at SEMICON SEA 2026, May 5-7, in Kuala Lumpur, Malaysia.
ACCM Unveils Negative and Near-zero CTE Materials for Large-Format AI Chips
04/21/2026 | Advanced Chip and Circuit MaterialsAdvanced Chip and Circuit Materials, Inc. (ACCM) has launched two new materials: Celeritas HM50, with a negative coefficient of thermal expansion (CTE) of -8 ppm/°C to offset the positive CTE and expansion of copper with temperature on circuit boards, and Celeritas HM001, with near-zero CTE and the low-loss performance needed for high-speed signal layers to 224 Gb/s and faster in artificial intelligence (AI) circuits.