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Beyond the Rulebook
What happens when the rule book is no longer useful, or worse, was never written in the first place? In today’s fast-moving electronics landscape, we’re increasingly asked to design and build what has no precedent, no proven path, and no tidy checklist to follow. This is where “Design for Invention” begins.
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From the growing role of AI in design tools to the challenge of managing cumulative tolerances, these articles in this issue examine the technical details, design choices, and manufacturing considerations that determine whether a board works as intended.
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I-Connect007 Magazine previews APEX EXPO 2026, covering everything from the show floor to the technical conference. For PCB designers, we move past the dreaded auto-router and spotlight AI design tools that actually matter.
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FLEX Technology Summit 2026 Spotlights Augmenting Flexible Hybrid Electronics with AI, Digital Twins, and XR
January 23, 2026 | SEMIEstimated reading time: 1 minute
The FLEX Technology Summit will be held on February 24-26, 2026, at the Wigwam Arizona Resort in Phoenix, Arizona, celebrating 25 years of innovation in flexible hybrid electronics (FHE), printed electronics, and advanced packaging. This year’s theme, “Edge of Reality: Augmenting Flexible Hybrid Electronics with AI, Digital Twins, and XR,” will focus on how emerging technologies are transforming FHE and related fields. Registration is open.
FLEX 2026 will feature keynotes, technical sessions, gap analyses, professional courses, industry tours, and a dynamic exhibit of solution providers showcasing the latest advancements in FHE, heterogeneous integration, MedTech, and more. Attendees will gain insights into cutting-edge equipment, processes, materials, and applications driving next-generation electronics. The event will also highlight innovations from public-private partnerships fostered by SEMI Technology Communities, FlexTech and Nano-Bio Materials Consortium (NMBC).
“For 25 years, FLEX has been integral in uniting the industry, academia, and government—pushing the boundaries of what’s possible in flexible hybrid electronics,” said Gity Samadi, Senior Director of R&D Programs at SEMI. “This milestone is not just a celebration of our progress, but a look into what’s next. At FLEX Technology Summit, we’ll reflect on the innovations that built the foundation to today's technologies and explore the breakthroughs that will revolutionize the next 25 years.”
FLEX Technology Summit 2026 Keynote Presentations:
- Michael D. McCreary, PhD, Chief Innovation Officer, Senior VP, E Ink
- Flexible ePaper Displays: From University Research to Global Corporation
- Roozbeh Ghaffari, Co-Founder, Chief Executive Office, Epicore Biosystems, Inc.
- Wearable Microfluidic Systems for Personalized Hydration and Health Management
- Lindsay Pack Moll, Chief Executive Officer, InnovaFlex USA
- From Idea to Fab
- Ani Kelkar, PhD, Partner, McKinsey & Company, Inc.
- Will Embodied AI Create Robotic Coworkers?
- John A. Rogers, Director, Northwestern University
- Flexible Bioelectronics – From Exploratory Research to Medical Translation
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Klaus Koziol - atgSuggested Items
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The Future of Reflow Soldering Is Here
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MEIKO Electronics Expands ASEAN Footprint with New Vietnam Subsidiary to Support Growing Demand
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From AI to AEP, an Impressive Array of Keynotes at APEX EXPO 2026
04/17/2026 | Marcy LaRont and Nolan Johnson, I-Connect007Each year at APEX EXPO, the Global Electronics Association provides an impressive lineup of keynote speakers to kick off the largest electronics manufacturing event in North America. This year included four keynote speeches, on topics ranging from the promise and peril of AI to the power of electronics, quantum computing, and the importance of heterogeneous integration in advanced electronics packaging.