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Advanced Electronics Packaging Digest

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Foxconn, Mitsubishi Electric Finalize Automotive Equipment Alliance

10/16/2026 | Foxconn
Through the alliance, the companies aim to develop next-generation mobility and thereby strengthen the sustainable growth of the Japanese automotive industry.

Global Smartphone Shipments Drop Record High of 22% in Q3 2026 as the Memory Crisis Hits Hard

10/15/2026 | IDC
The global smartphone market shrank 22.0% year-on-year to 255.3 million units in the third quarter of 2026 (3Q26), according to the preliminary data from IDC Research (IDC) Worldwide Quarterly Mobile Phone Tracker.

The Clean Truth: The Clean Truth About No-Clean Flux

10/14/2026 | Dr. Adam Klett -- Column: The Clean Truth
One of the most misunderstood terms in electronics manufacturing is “no-clean flux.” It sounds simple enough: Use the flux, complete the soldering process, and, best of all, you don’t have to clean. Unfortunately, that interpretation has led to decades of confusion and, in some cases, preventable reliability problems.

Rehm Thermal Systems Strengthens Its Presence in Spain and Portugal: Propelec Appointed as New Representative

10/14/2026 | Rehm Thermal Systems
Rehm Thermal Systems is expanding its sales activities in the Spanish and Portuguese markets and has appointed Propelec S.L. as its new representative for the Protecto and RDS UV LED product ranges.

LITEON September Sales Rise 22% on Strong AI and Cloud Demand

10/14/2026 | LITEON Technology
LITEON’s consolidated revenue for September reached NT$18.8 billion, representing a 22% Y-o-Y increase.
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