Flexible Thinking: Designing Flex Circuits for Dynamic Reliability
Global PCB Connections: Rigid-flex and Flexible PCBs—The Backbone of Modern Electronics
Happy’s Tech Talk #29: Bend-to-Install Semi-flex FR-4
What a year it’s been! I don’t think anyone could have anticipated the level of shake-up that was to come on the global trade scene when U.S. President Donald Trump came into his second term in January, but the drama that has ensued rivals anything ever aired on “The Apprentice.” However, I am somewhat heartened by our current position compared to how things felt in Q2 of this year. Much remains to be worked out, but as we sprint into the new year, there are three things I know for sure: 1) Working in tech is never dull—you will not be bored in 2026; 2) Expect to work very hard; and 3) Business, like life, will go on no matter what. I hope you enjoy my picks for week: all good reads for different reasons. Happy New Year!
Merry Christmas from I-Connect007!
Published December 24
I have to say it one final time! Or rather, I hope you and yours had a lovely Christmas holiday yesterday, if you celebrate. Nolan Johnson’s Christmas message on the genesis of the gingerbread house is a fun way to end the year and close out the Christmas holidays! Can you say, “lebkuchen?” And as he said, “From our gingerbread house to yours…”
Why AI/ML May Be the Next Big Step for PCB Fabs
Published December 23
Sydney Xiao, president of Global Electronics Association East Asia, states, “PCB manufacturing is approaching a pivotal moment across the global electronics supply chain.” She couldn’t be more right! Taking a hard look at the traditional way PCB factories have grown in view of what is being required of PCB fabricators today, in everything from technology to ESG reporting, she posits that the traditional model may be reaching its natural end. But fear not, because AI and ML are no longer just “abstract concepts, or futuristic visions, but practical capabilities.” What’s next for PCB fabricators? Read on.
The New Energy Equation: Collaboration, AI, and the Future of Power Management
Published December 23
I’ve written several times this past year that I believe the world’s power situation—the supply, both real and near-term projected—as compared to the demand that will be needed to support AI technologies, high power computing, and the development of lots of massive data centers, is likely to be the hard-stop that prevents technology from progressing past a certain point. What is being done today in that sector to address the anticipated massive need? My interview with Mark Biddinger of Schneider Electric is enlightening and (a little) encouraging. Power touches all of us, every minute of every day, so if you think this is not your headache, think again.
The Road to Bengaluru: Skilled Pros Competing in Wire Harness Competitions
Published December 23
India’s premier electronics trade show, IEMI show, takes place on Jan. 29–30, so it seems fitting to highlight two things: the introduction of a new wire harness skills competition hosted by the Global Electronics Association that will commence in 2026, starting at IEMI in Bengaluru; and the fact that India and the UAE are emerging as hubs for wire harness prowess. As Arpita Das writes, “From EVs and aerospace to automation and consumer electronics, wire harnesses are essential for reliable connectivity and drive investments in skilled talent, standardization, and innovation.” As I-Connect007 expands its coverage to other relevant areas within electronics manufacturing, we celebrate this next chapter for this segment of our industry and the professionals who work within it.
Fresh PCB Concepts: Choosing Via Types—A Practical Guide for PCB Engineers
Published December 22
Last but definitely not least, I’m highlighting NCAB’s Ramon Roche’s column, “Choosing Via Types—A Practical Guide for PCB Engineers.” I love tech talk, and Ramon does not disappoint with this educational piece, getting back to some real foundational knowledge for the newer PCB engineer. Vias—how many and what type—are still a significant cost driver for printed circuit boards. They relate to density and layer counts, and are the pathway by which signals are transmitted through the network of traces and circuitry that comprise a PCB. From your basic through-hole via to blind and buried vias, this is a solid read.
