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Advanced Electronics Packaging Digest

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Stay ahead of the technologies shaping the future of electronics with our latest newsletter, Advanced Electronics Packaging Digest. Get expert insights on advanced packaging, materials, and system-level innovation, delivered straight to your inbox.

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Suggested Items

Insulectro Signs Covestro as Supplier of Advanced Substrates

06/09/2026 | Insulectro
Insulectro, the largest distributor of materials used in the manufacturing of printed circuit boards and printed electronics, welcomes Covestro as its newest supplier.

PARMI Supports Customer Demonstration Request at Technica USA Demo Center

06/08/2026 | Technica USA
PARMI USA recently responded to a customer-requested demonstration of the PARMI Exceed, the company’s state-of-the-art AI-powered Automated Optical Inspection (AOI) system, at the Technica USA Demo Center.

Technica USA Welcomes ASMPT Support Team for SIPLACE SX Demo Days Event

06/05/2026 | Technica USA
Technica USA, in partnership with ASMPT, hosted a successful Demo Days event this week at its San Jose facility.

Will Gutierrez Joins Technica USA in West South-Central Territory

06/02/2026 | Technica USA
Technica USA is pleased to announce the hiring of Will Gutierrez as Business Development/Account Manager responsible for the West South-Central Territory. Will shall be responsible for all PCBA, Substrate and PCB related sales activities and customer support throughout Texas, Oklahoma, Arkansas and Louisiana operating from the state of Texas.

Technica Tech Day Event on AI and the Large BGA Solution Hits the Mark

05/27/2026 | Technica USA
On May 13–14, 2026, Technica USA hosted its Tech Day Event in San Jose, California, bringing together more than 25 companies and over 60 attendees from across the electronics manufacturing industry. The event focused on how the rapid evolution of artificial intelligence is driving new manufacturing requirements and changing the technologies used for SMT placement, inspection, and process control.
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