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December 3, 2025 | MKS Inc.Estimated reading time: 2 minutes
MKS Inc., a global provider of enabling technologies that transform our world, announced its participation in the HKPCA Show, taking place December 3–5 at Shenzhen World Exhibition & Convention Center. Under its strategic brands, Atotech® – offering process chemicals, equipment, software, and services – and ESI®, known for laser systems, MKS will showcase its latest advancements in printed circuit board (PCB) and package substrate manufacturing.
In the coming years, the rapid advancement of downstream application sectors – such as new energy vehicles, consumer electronics, next-generation communication technologies, cloud computing, the Internet of Things, smart homes, and wearable devices – is set to accelerate the PCB industry into a dynamic new growth cycle. MKS is fully prepared to meet these emerging challenges head-on and is looking forward to exploring the exciting possibilities that AI has to offer.
Representatives from both brands will be present at booth 8F20, where the company will unveil its latest innovations in lasers, optics, motion control, process chemistry, and advanced equipment – technologies that are redefining the future of PCB manufacturing. These highlights will offer visitors valuable insights into how MKS is tackling interconnect challenges and enabling the development of next-generation miniaturized electronics with exceptional precision and reliability.
“Artificial Intelligence is not just a trend – it’s a transformative force reshaping the entire electronics ecosystem. At the 2025 HKPCA Show, we’re proud to provide a platform where innovation meets opportunity, empowering businesses to thrive in the AI-driven future,” said Dr. James Tsai, Business Director of Greater China.
Chemistry show highlights include:
- Printoganth® P2: Most capable horizontal electroless Cu process for excellent throw into BMVs and nano-void free deposits suitable for advanced dielectric materials (5G, FPCB, etc.)
- Cupraganth® MV: Next-generation palladium-free e’less copper activation for package substrates
- InPulse® 2HT2: Enables reliable conformal copper plating across substrates with varying hole densities, ensuring effective wetting and plating of blind micro vias and through via
- Cuprapulse® IN: Reverse pulse plating with insoluble anodes for HDI, MLB, and ICs
- NovaBond® PX-S2: Advanced bonding enhancement for high-speed signal transmission
- EcoFlash® S 300 U: Iron sulfate-based differential etchant that increases yield and lowers cost by preventing undercuts, maintaining circuit integrity, and reducing roughness while allowing easy iron regeneration with hydrogen peroxide
- PallaBond® 2: The next-gen EPAG for high-end circuitry and reliability applications
- Stannatech® 2100: New optimized immersion tin process of the Stannatech evolution
Our equipment highlights for PCB production are:
- vPlate®: Gold standard for vertical conveyor plating equipment for next-generation HDI PCB and package substrates
- New Uniplate®: The industry-leading horizontal plating tool for next-generation HDI PCBs and package substrate manufacturing
- Stannatech Line®: New GEN Immersion Tin Line for high volume production requirements
- PLB Line®: Excellent BMV capability enabling HDI PCB production
On the laser equipment side, promotions include:
- Geode™ platform solutions: Next generation PCB and advanced substrate CO2 and UV laser via drills
- Geode™ G2 PCB laser drill: Next generation CO2 via drilling for HDI and integrated circuit packaging manufacturing – built to drill the ultimate via
- CapStone™ Flex PCB laser drill: Breakthrough productivity – Increase throughput up to 2x and reduce overall processing costs by 30%
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