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Getters, Thermal Management, and High-Reliability Packaging: What’s Ahead in the Next Issue of Advanced Electronics Packaging Digest

06/10/2026 | I-Connect007
The upcoming issue of Advanced Electronics Packaging Digest explores several technologies shaping the future of advanced packaging, from maintaining stable environments inside hermetic packages to managing heat in increasingly complex 3D architectures. The issue also examines packaging innovations for aerospace, defense, and automotive applications, as well as broader connections between semiconductor interconnects and the systems they support.

RTX's Collins Aerospace Quadruples MRO Footprint in Malaysia

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Beagle 2 touched down on Mars on Christmas Day 2003 but fell silent and was presumed lost for over a decade. In January 2015, NASA imagery confirmed it had landed safely and precisely on target — its silence likely caused by a single solar panel failing to fully deploy.

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