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What happens when the rule book is no longer useful, or worse, was never written in the first place? In today’s fast-moving electronics landscape, we’re increasingly asked to design and build what has no precedent, no proven path, and no tidy checklist to follow. This is where “Design for Invention” begins.
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From the growing role of AI in design tools to the challenge of managing cumulative tolerances, these articles in this issue examine the technical details, design choices, and manufacturing considerations that determine whether a board works as intended.
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I-Connect007 Magazine previews APEX EXPO 2026, covering everything from the show floor to the technical conference. For PCB designers, we move past the dreaded auto-router and spotlight AI design tools that actually matter.
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PDN Optimization: Balancing Performance and Cost in SoC Designs
October 22, 2025 | Zach Caprai. Siemens EDAEstimated reading time: Less than a minute
The evolution of adaptive system-on-chip (SoC) devices has brought unprecedented computing capabilities to modern electronic systems. However, with this advancement comes increasingly complex power delivery challenges. In particular, as organizations strive to accelerate time-to-market while managing costs, optimizing power delivery networks (PDNs) has become a critical factor in successful product development.
This article demonstrates advanced PDN optimization techniques through a real-world case study of AMD’s Versal adaptive SoC platform. Using the VCK190 evaluation kit featuring the Versal AI Core series VC1902 device, I’ll explore how effective PDN design and optimization can help meet demanding technical specifications while addressing essential business goals.
Understanding Modern PDN Challenges
Modern SoCs require precise power delivery across a broad frequency spectrum, from DC to the gigahertz range. The PDN must maintain stable voltage levels while managing current transients and minimizing impedance across all frequencies. For configurable devices like the AMD Versal adaptive SoC, this challenge is particularly complex because power requirements vary significantly based on device configuration and application.
To read this entire article, which appeared in the October 2025 issue of Design007 Magazine, click here.
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Single Pair Ethernet (SPE): A Valuable Option for Modern Designs
04/20/2026 | Marcy LaRont, I-Connect007When it comes to designing PCBs and full systems for increasingly complex electronics hardware, who doesn’t want to reduce complexity and cost? Single-Pair Ethernet (SPE) has emerged as a solution and is gaining rapid attention across industrial electronics and PCB design because it enables Ethernet communication over a single twisted pair, replacing the traditional two- or four-pair cabling used in standard Ethernet networks. This seemingly simple shift has significant implications for designers: smaller connectors, reduced cable weight, longer reach, and the ability to carry both data and power over a single pair.
Webinar Review, Part 2: Building the AI Backbone at IBM on Systems-level Packaging
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Alpha and Omega Semiconductor Begins IPM5 Production at Kaynes Semicon Launch in Gujarat
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