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Zhen Ding Builds a New Blueprint of “Semiconductor + Advanced Packaging + PCB” “One ZDT”
October 22, 2025 | Zhen DingEstimated reading time: Less than a minute
Zhen Ding builds a new blueprint of “Semiconductor + Advanced Packaging + PCB” “One ZDT” strategy rides the wave of heterogeneous integration to seize the AI industry high ground. The annual PCB industry event, TPCA Show 2025, kicked off today (Oct. 22) at the Nangang Exhibition Center.
Zhen Ding Tech Group showcased a full range of high-end PCBs and IC substrates under the theme of Artificial Intelligence (AI). Chairman Charles Shen pointed out that over the past 20 years, IC substrates have grown 20 times larger, increased in layer count by more than fourfold, and seen connection points surge by 300 times — resulting in overall complexity rising over 24,000 times.
This evolution signifies that PCBs have transformed from mere connectors into core enablers of AI computing performance. Facing this AI- and high-performance computing-driven revolution, Zhen Ding has strengthened its “One ZDT” strategic layout, pioneering a new ecosystem of “Semiconductor + Advanced Packaging + PCB” to fuel future growth momentum.
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