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MKS Inc., a global provider of enabling technologies that transform our world, announced that its strategic brands Atotech (process chemicals, equipment, software, and services) and ESI (laser systems) will showcase their latest range of leading manufacturing solutions for printed circuit board (PCB) and package substrate manufacturing at the upcoming 26th TPCA Show 2025 to be held at the Taipei Nangang Exhibition Center from 22-24 October 2025.
MKS’ Atotech is reinforcing its leadership in enabling the next generation of advanced electronics. Through the integration of cutting-edge technologies, including laser drilling, precision chemistry, plating equipment, and process innovation, the company continues to advance its proprietary Optimize the InterconnectSM approach. This strategy supports the increasing demands for miniaturization, complexity, and performance in PCB and package substrate manufacturing.
Visitors to the TPCA Show can explore these innovations firsthand at booth N-620, where experts from both MKS strategic brands, Atotech and ESI, will be available to discuss how MKS is empowering customers with cutting-edge technologies and comprehensive support.
MKS’ Atotech is advancing innovation across APAC and global markets by strengthening partnerships with leading manufacturers and accelerating the adoption of breakthrough technologies. These collaborations are key to meeting industry demands for smaller feature sizes and greater reliability.
By integrating MKS’ ESI laser systems with Atotech’s advanced chemistry and plating equipment, MKS delivers a comprehensive, one-stop solution for electronics manufacturing. This unified approach combines optimized laser drilling, plating, and surface modification chemistries with state-of-the-art equipment – enabling seamless pre-treatment, via formation, plating, and final finishing.
This innovative approach results in improved yields, enhanced productivity, and superior performance – all without production interruptions.
“MKS doesn’t just support innovation – it enables it. Our integrated technologies are shaping the future of electronics manufacturing,” said Dave Henry, Executive Vice President, Global Strategic Marketing and General Manager.
In 2025, MKS’ Atotech is driving innovation in advanced electronics manufacturing through strategic investments in its Asia-based technology centers. These enhancements accelerate development for next-gen package substrates and support high-end SAP applications with line/space requirements of ≤5/5µm.
In partnership with industry leaders, MKS is advancing modified semi-additive process (mSAP) technology for substrate-like PCBs. By leveraging its combined expertise, the company is delivering more sustainable solutions aligned with global CO₂reduction goals and environmental commitments. “Our mission is to drive innovation while supporting the industry’s transition to more sustainable manufacturing practices,” said Harald Ahnert, Vice President and General Manager of Chemistry at MKS’ Materials Solutions Division.
“Atotech is proud to contribute to the industry’s move toward more advanced and eco-friendly production methods,” added Wayne Cole, Senior Vice President of Global Sales and Service at MKS. “Our solutions are designed to meet the demands of next-generation electronics manufacturing, empowering our customers to stay competitive in a rapidly evolving market.”
In the field of surface treatment chemistry, three key innovations stand out:
EcoFlash® S300U, a differential etching solution designed for advanced package substrates, enabling precise material removal in SAP manufacturing. Novabond® PX-S2 promotes strong inner-layer adhesion through nano-roughening and hybrid bonding, tailored for high-speed AI and HPC applications and Bondfilm® EX that enhances signal integrity by minimizing signal loss in high-frequency environments, making it ideal for next-generation electronics such as 5G and RF modules. For metallization, this year’s highlights include Printoganth® MV TP3 which enables the ultra-thin copper deposition that is essential for fine features down to 2/2 µm L/S, and Printoganth® P2, our latest high-throwing power horizontal electroless copper process. With the future in mind, Cupraganth® MV, is MKS’ Atotech revolutionary copper-based activation system for advanced packaging applications. For electrolytic copper plating, the company highlights an advanced copper filling process for high-aspect-ratio through-glass vias, InPro® Pulse TGV, and the production-proven Cuprapulse® IN for reverse pulse plating with insoluble anodes for HDI, MLB and Package Substrates. For final finishing highlights range from Aurotech® G-Bond 3, a versatile gold bath for nickel/gold, nickel/palladium/gold and palladium/gold plating to Stannatech®2100, MKS’ Atotech reliable cost effective final finish for ultimate solderability and corrosion resistance and PD Core® a low metal electroless palladium bath for ENEPIG and EPAG applications. NEAP, a non-etching adhesion promoter for lead frame packages to prevent delamination issues between silver metal surfaces and epoxy molding compound and Protectostan® Plus 3, a green (PFAS free) post-dip for tin to preserve solderability under steam aging and heat exposure complete the portfolio.
PCB equipment systems promotions include G-Plate®, a new HVM tool for PTH processes of next generation package substrates enabling highest yields and cutting-edge fine line capability targeting L/S <5/5 µm, vPlate®, a new vertical continuous plating tool for advanced HDI and Package Substrate for best-in-class surface uniformity – and last but not least the new Uniplate®, the company’s flagship HVM system and industry-leading horizontal plating equipment for next-generation HDI PCBs and Package Substrate manufacturing. Complementing these systems is the PLB Line®, designed for excellent blind micro via (BMV) and high aspect ratio through-hole (TH) capability, enabling robust HDI and MLB production -particularly suited for demanding applications such as AI server boards.
Laser equipment promotions include the latest Capstone™, a high-performance/throughput breakthrough productivity for flex PCB UV drilling and Geode™ platform (CO2 and UV laser for HDI and package substrate applications). A special show highlight Geode™ A a new CO2 laser system for high precision and high-speed ABF build-up laminate processing. Geode™ G2 the new CO2 laser system for high-precision and high-speed HDI and mSAP via drilling. The Geode™ platform provides increased productivity, the smallest footprint, and the lowest power consumption in the market.
Daniel Schmidt, Director Global Marketing and Training, said, “We are proud to continue our partnership with IMPACT and to be hosting the IMPACT industrial forum session entitled “Enabling AI and HPC: Technology inflections across advanced packaging and interconnect” this year. Our session will spotlight innovations in advanced AI packaging, including the transition from organic substrates to glass core, and cutting-edge PCB process solutions designed to meet the evolving demands of AI chip and package substrate manufacturing. In addition this year, MKS’ strategic brands Atotech and ESI are not only sponsoring and participating in the distinguished IMPACT conferences, but also engaging in the newly revamped Tech x Total Solution Seminar, where two presentations will be delivered by the Taiwan expert team from Surface Technology and Equipment.”
