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Advanced Electronics Packaging Digest

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Micron Unveils U.S. Research Lab for Memory and AI Innovation

08/20/2026 | Globe Newswire
Micron Technology, Inc. unveiled Micron Research Labs, a U.S.-based long-horizon premier research institution headquartered in Boise and backed by a planned $10 billion investment over the next decade.

Sypris Wins Award for High-Volume LEO Satellite Program

08/20/2026 | BUSINESS WIRE
Sypris Electronics, LLC, a subsidiary of Sypris Solutions, Inc., announced that it has received an award from a leading space technologies company to support the non-recurring engineering, material procurement, and high-volume manufacturing of power processing units for a next-generation satellite constellation.

HIROSE Electric Americas President Mark Kojak Named to ECIA Manufacturer Council

08/20/2026 | HIROSE Electric Americas
HIROSE Electric Americas is pleased to announce that Mark Kojak, President of HIROSE Electric Americas, has been named to the Electronic Components Industry Association’s (ECIA) Manufacturer Council.

P Kay Metal's MS2 Dross Eliminator Delivers Measurable Results for Electronics Manufacturers Across Latin America

08/20/2026 | P. Kay Metal, Inc.
P Kay Metal is seeing growing adoption of its MS2 Dross Eliminator throughout the region, with customers consistently reporting solder recovery rates of 80–85%.

Flex Connections: Four Lessons in Engineering Judgment for PCB Designers

08/20/2026 | Dan Skeweres -- Column: Flex Connections
Editor’s note: This begins a new column series by Flexible Circuit Technologies, which will appear monthly in "I-Connect007 Magazine". The column will feature five rotating authors who share expertise from their many years of working with flexible circuits.
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