Share on:

Share on LinkedIn Share on X Share on Facebook Share with email


Advanced Electronics Packaging Digest

Subscribe

Stay ahead of the technologies shaping the future of electronics with our latest newsletter, Advanced Electronics Packaging Digest. Get expert insights on advanced packaging, materials, and system-level innovation, delivered straight to your inbox.

Subscribe now to stay informed, competitive, and connected.

Suggested Items

Server DRAM Contract Prices to Rise 13-18% QoQ in 3Q26 Amid Long-Term Price Caps

07/09/2026 | TrendForce
TrendForce’s latest memory pricing survey indicates that multiple memory suppliers have already factored in expected price hikes into their prices for the second quarter of 2026.

Micron Begins Construction of Cleanroom at Hiroshima Plant to Support Advanced Memory for AI Applications

07/07/2026 | Micron
Micron Technology, Inc. today announced the commencement of construction on a new cleanroom at its Hiroshima plant in Higashihiroshima, Hiroshima Prefecture.

AI Server Demand Keeps Memory Prices Up in 3Q26, but Gains Moderate

07/03/2026 | TrendForce
TrendForce’s latest memory pricing survey reveals that the DRAM market will remain extremely tight in the third quarter of 2026.

Applied Materials Introduces New Systems to Accelerate DRAM and Advanced Packaging for AI Chips

07/02/2026 | Applied Materials
Applied Materials, Inc., the leader in materials engineering for the semiconductor industry, introduced a suite of new chipmaking systems for building the advanced 3D chip architectures that power next-generation AI.

Imec Achieves Breakthroughs in Ferroelectric Memory for AI-Era Needs

06/22/2026 | Imec
At the 2026 IEEE / JSAP symposium on VLSI Technology & Circuits, imec, a world-leading research and innovation hub in advanced semiconductor technologies, presents two advances in ferroelectric memory research, targeting both ferroelectric capacitors and ferroelectric field-effect transistors as emerging candidates to enable low-voltage operation and high-density integration.
Copyright © I-Connect007 | IPC Publishing Group Inc. All rights reserved. Log in