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Hanwha Aerospace to Collaborate with BAE Systems on Advanced Anti-jamming GPS for Guided Missiles
September 15, 2025 | HanwhaEstimated reading time: 1 minute
Hanwha Aerospace has signed a contract with BAE Systems to integrate next-generation, anti-jamming Global Positioning System (GPS) technology into Hanwha Aerospace’s Deep Strike Capability precision-guided weapon system.
This contract brings the two aerospace and defense technology companies together to collaborate in the critical field of advanced guidance technology. The collaboration will leverage BAE Systems’ world-renowned expertise in military GPS and anti-jamming solutions to counter sophisticated electronic warfare threats.
"The purpose of this cooperation with BAE Systems is to secure advanced electronic warfare protection technology to protect our guided weapon systems," said Billy Boo-hwan Lee, the Head of PGM Business Group of Hanwha Aerospace. “Based on a technological advantage to counter electronic warfare threats, we will strengthen our position in the global market.”
“Our collaboration with Hanwha will help give operators added versatility in the field when they need it most,” said Luke Bishop, Director of Navigation and Sensor Systems at BAE Systems. “That versatility combined with our highly reliable military GPS products provides users with a product they can trust will work in the most contested environments.”
Hanwha's Deep Strike Capability system provides a flexible, multi-caliber, and multi-range rocket launch capability, adaptable to diverse missions, from suppressing enemy fire support to neutralizing targets in complex environments. Furthermore, its dual-launcher configuration allows the deployment of a wide range of guided rockets from a single platform, delivering superior firepower and operational flexibility.
The new guidance system, developed through this collaboration, is expected to provide Hanwha’s Deep Strike Capability system with superior precision and operational reliability, even in highly contested electronic environments.
This initiative is strategically engineered to meet NATO interoperability requirements, significantly enhancing the marketability of the system to European and other allied nations.
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Brent Fischthal - Koh YoungSuggested Items
Redwire Announces Contract to Deliver Stalker Uncrewed Aerial Systems to Another European NATO Ally
09/18/2025 | BUSINESS WIRERedwire Corporation, a global leader in space and defense technology solutions, announced that its wholly owned subsidiary, Edge Autonomy, has been awarded a contract from an undisclosed European NATO country to deliver its Edge Autonomy Stalker Group 2 fixed wing uncrewed aerial system (UAS) to perform long-range reconnaissance and intelligence gathering.
India’s Aerospace and Defence Engineered for Power, Driven by Electronics
09/16/2025 | Gaurab Majumdar, Global Electronics AssociationWith a defence budget of $82.05 billion (2025–26) and a massive $223 billion earmarked for aerospace and defence spending over the next decade, India is rapidly positioning itself as a major player in the global defence and aerospace market.
VIDEOTON EAS's Bulgarian Subsidiary Expands Into Automotive Products
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Variosystems Strengthens North American Presence with Southlake Relaunch 2025
09/15/2025 | VariosystemsVariosystems celebrated the relaunch of its U.S. facility in Southlake, Texas. After months of redesign and reorganization, the opening marked more than just the return to a modernized production site—it was a moment to reconnect with our teams, partners, and the local community.
EV Group Achieves Breakthrough in Hybrid Bonding Overlay Control for Chiplet Integration
09/12/2025 | EV GroupEV Group (EVG), a leading provider of innovative process solutions and expertise serving leading-edge and future semiconductor designs and chip integration schemes, today unveiled the EVG®40 D2W—the first dedicated die-to-wafer overlay metrology platform to deliver 100 percent die overlay measurement on 300-mm wafers at high precision and speeds needed for production environments. With up to 15X higher throughput than EVG’s industry benchmark EVG®40 NT2 system designed for hybrid wafer bonding metrology, the new EVG40 D2W enables chipmakers to verify die placement accuracy and take rapid corrective action, improving process control and yield in high-volume manufacturing (HVM).