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The rapid advance of technology is driving changes in electronics that require increasingly smaller boards capable of handling higher signal speeds and supporting more robust software applications. Manufacturers are increasingly called upon to produce ultra high density interconnect (UHDI) PCBs, so it’s important to tune our production capabilities and customer service models to this trend. Non-conductive via fill (NCVF) offers a cost-effective, reliable manufacturing method that accommodates the densely packed, fine-pitch ball grid array (BGA) components present in UHDI designs.

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05/18/2026 | I-Connect007
I-Connect007 proudly announces the recent release of The Printed Circuit Designer’s Guide to…™ UV Curable Conformal Coatings. Authored by respected industry technologists Brian Chislea and Cody Schoener, PhD, of Dow, Inc., this new volume offers a comprehensive exploration of UV-curable conformal coatings and their expanding role in improving the protection, performance, and sustainability of electronic assemblies.

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05/15/2026 | I-Connect007
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ASC Sunstone Circuits to Exhibit at PCB East 2026

04/26/2026 | ASC Sunstone Circuits
Anaya Vardya, President and CEO of ASC Sunstone Circuits, a leading provider of printed circuit board (PCB) fabrication and assembly solutions, announced that the company will be exhibiting at PCB East 2026, taking place April 29 at the DCU Convention Center.

Target Condition: When Design Outpaces Manufacturing

04/23/2026 | Kelly Dack -- Column: Target Condition
Most PCB designers already understand why design for manufacturing (DFM) matters. If a product can’t be built reliably, repeatedly, and at a price anyone will actually pay, it’s dead on arrival. You may have the most elegant schematic and layout ever drawn in a CAD tool, but if the PCB suppliers can’t make it, or the EMS sources refuse to quote it, you may well be considered more of a Nutty Professor or well-meaning inventor than a PCB designer.
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