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Advanced Electronics Packaging Digest

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Coherent Secures $50M CHIPS LOI to Expand AI Infrastructure Manufacturing

06/18/2026 | Coherent
Coherent Corp., the global photonics leader, today announced it has signed a letter of intent to receive up to $50 million in direct funding under the CHIPS and Science Act from the U.S. Department of Commerce to expand its world-leading 6-inch Indium Phosphide (InP) semiconductor manufacturing facility in Sherman, Texas.

Keysight Expands Photonic Design Automation Portfolio with System-Level Simulation

06/17/2026 | BUSINESS WIRE
Keysight Technologies, Inc. announced that it completed the acquisition of VPIphotonics on June 9, 2026, adding system-level simulation to its photonic design automation portfolio and enabling optical and electrical engineers to advance designs from component to complete link within a single environment.

Pilot Photonics Secures €1M ESA Contract for Space Photonics Development

06/04/2026 | PRNewswire
Pilot Photonics, the leading Irish developer of integrated photonic engines, announces a new €1M contract with the European Space Agency (ESA) for space-proofing the company's Optical Frequency Generator Unit (OFGU).

Lightium Selects Aras Innovator to Support Development of Photonic AI Chips

05/12/2026 | BUSINESS WIRE
Aras, a leading provider of digital thread solutions for product lifecycle management (PLM) and engineering AI, announced that Lightium, a Switzerland-based startup specializing in photonic integrated circuits (PICs), has selected Aras Innovator® to establish a connected foundation for managing the complexity of its photonic chip development.

Molex Completes Acquisition of Teramount Ltd.

05/07/2026 | PRNewswire
Molex, a global electronics leader and connectivity innovator, has completed the acquisition of Teramount Ltd., an Israel‑based developer of detachable fiber‑to‑chip connectivity solutions optimized for high‑volume Co‑Packaged Optics (CPO) and other silicon photonics applications.
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