Share on:

Share on LinkedIn Share on X Share on Facebook Share with email


Advanced Electronics Packaging Digest

Subscribe

Stay ahead of the technologies shaping the future of electronics with our latest newsletter, Advanced Electronics Packaging Digest. Get expert insights on advanced packaging, materials, and system-level innovation, delivered straight to your inbox.

Subscribe now to stay informed, competitive, and connected.

Suggested Items

Intel, Google Cloud Announce Collaboration to Accelerate Intel’s AI-Enabled Enterprise Transformation

07/21/2026 | Intel Corporation
Intel and Google Cloud announced an expansion of their previously announced multi-year strategic collaboration, which would accelerate Intel’s enterprise-wide digital evolution through the deployment of Gemini Enterprise and Google Cloud.

Foxconn Conducts 85 RBA VAP Audits, Earns Six Platinum Certifications

07/14/2026 | Foxconn
Foxconn Technology Group continues to deepen its core concept of "EPS + ESG = Sustainable Operation" and released its latest annual third-party audit summary report.

Power Delivery, AI Infrastructure, and Materials Innovation: What’s Ahead in the Next Issue of Advanced Electronics Packaging Digest

07/14/2026 | I-Connect007 Editorial Team
The upcoming issue of Advanced Electronics Packaging Digest examines three areas where packaging technology is increasingly defining system performance: power delivery for AI accelerators, the rapid expansion of AI data centers, and the growing importance of substrate materials in high-reliability electronics. Together, these features explore how packaging decisions influence performance, reliability, and long-term scalability across the electronics ecosystem.

Sumitomo Chemical Subsidiary to Establish of a Joint Venture with Samsung Electro-Mechanics for the Glass Core Substrate Business

07/13/2026 | Sumitomo Chemical
Sumitomo Chemical today announced that its wholly owned Korean subsidiary, Dongwoo Fine-Chem Co., Ltd. , has signed a joint venture agreement with Samsung Electro-Mechanics Co., Ltd. to establish a joint venture company that will engage in the business of glass core substrates for advanced semiconductor packages.

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

07/10/2026 | Michelle Te, I-Connect007
This week, I’ve been enjoying time with all my young adult children and our 2-year-old grandson. He is a bundle of energy, curiosity, opinions, and above all else, joy. Little children are constant reminders to stop and appreciate all the beauties of life in their most simplest form. I think that’s one reason Dan Beaulieu’s column this week resonated with me so much. Life is serious, business is serious, solving problems is serious. But how we approach these parts of our lives matters. Dan reminds us that we can do important work with joy. Strong businesses recognize that culture is a strategic asset, not a nice-to-have. People perform better when they find purpose and satisfaction in what they do.
Copyright © I-Connect007 | IPC Publishing Group Inc. All rights reserved. Log in