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ASMPT Announces Strategic Optimization of Manufacturing Operations, Closes Shenzhen Factory

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ASMPT, a global leader in semiconductor and electronics manufacturing, announced today a strategic optimization of its manufacturing operations in China.

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New Podcast Episode Drop: Understanding How Chemistry and Drilling Collaborate for OTI

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ASMPT Introduces MEGA Multi-chip Bonding Platform

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Trouble in Your Tank: Metallizing Flexible Circuit Materials—Mitigating Deposit Stress

08/04/2025 | Michael Carano -- Column: Trouble in Your Tank
Metallizing materials, such as polyimide used for flexible circuitry and high-reliability multilayer printed wiring boards, provide a significant challenge for process engineers. Conventional electroless copper systems often require pre-treatments with hazardous chemicals or have a small process window to achieve uniform coverage without blistering. It all boils down to enhancing the adhesion of the thin film of electroless copper to these smooth surfaces.
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