Share on:

Share on LinkedIn Share on X Share on Facebook Share with email


Advanced Electronics Packaging Digest

Subscribe

Stay ahead of the technologies shaping the future of electronics with our latest newsletter, Advanced Electronics Packaging Digest. Get expert insights on advanced packaging, materials, and system-level innovation, delivered straight to your inbox.

Subscribe now to stay informed, competitive, and connected.

Suggested Items

Infineon Completes Acquisition of ams OSRAM Sensor Portfolio

07/01/2026 | Infineon
Infineon Technologies AG completed the acquisition of the non-optical analog/mixed-signal sensor portfolio from ams OSRAM Group.

Ouster, Benchmark Expand Partnership to Scale REV8 Lidar Production

06/18/2026 | Benchmark
Ouster, Inc., a leader in sensing and perception for Physical AI, and Benchmark Electronics, Inc., a global provider of manufacturing, engineering, and technology services, announced the expansion of their long-term manufacturing partnership to support the high-volume production of Ouster's new Rev8 OS sensor family for industrial, robotics, automotive, and smart infrastructure applications.

Teledyne FLIR Defense Awarded $11.2M U.S. Army Contract for Advanced CBRN Sensor Drone Kits

06/04/2026 | BUSINESS WIRE
Teledyne Technologies Incorporated announced that Teledyne FLIR Defense, a global leader in intelligent sensing and unmanned systems, has won an $11.2 million contract from the U.S. Army’s Capability Program Executive for Chemical, Biological, Radiological and Nuclear Defense (CPE CBRND) to deliver more than 45 advanced CBRN unmanned aerial system (UAS) kits.

TDK Drives the Growth of Sensor Business with New Factory in Japan

06/03/2026 | TDK
TDK Corporation announces the establishment of the “TDK Shinano River Techno Factory” in Ojiya City, Niigata Prefecture, Japan, with the aim of further expanding its sensor business.

Teledyne Space Imaging Sensors Launch Aboard European Space Agency’s SMILE Mission

05/20/2026 | BUSINESS WIRE
Teledyne Space Imaging, a leading supplier of space-qualified imaging sensors, focal plane arrays and integrated camera systems, announced it supplied two CCD370 imaging sensors for the Soft X-ray Imager on the European Space Agency’s SMILE mission (Solar wind Magnetosphere Ionosphere Link Explorer).
Copyright © I-Connect007 | IPC Publishing Group Inc. All rights reserved. Log in