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When Small Just Isn’t Small Enough; INSPECTIS Launches Micro Size Optical Probe Tip for BGA Inspection
June 3, 2025 | INSPECTISEstimated reading time: 1 minute

The Inspectis BGA inspection system now offers the tiniest optical probe, the Micro Size Optical Probe Tip, for users who feel that they need to get ‘really small’. As BGA packages and their standoffs continue to shrink, viewing under them becomes ever more difficult, making accurate and comprehensive inspection extremely challenging. The Micro Size Optical Probe Tip, however, works like an inverted periscope, viewing the underside of tiny components at a 90-degree angle with an optical probe tip footprint of only 0.4 x 3.5 mm and a width of only 3.5mm.
“The Inspectis BGA inspection system now features the tiniest optical probe with high-resolution optics,” said Alistair Gooch, Marketing Manager. “With its built-in LED lighting, 5.0-megapixel image sensor and high-power background illumination, the Inspectis BGA Inspection System, equipped with the Micro Size Optical Probe Tip, produces high-resolution images of the extremely low-clearance areas beneath BGAs and other tiny packages with as low as 40 microns stand-off.”
Ergonomically designed, the unit is mounted on a compact yet robust stand with an X-Y translation stage for maximum flexibility and configurability. The unique side-view BGA Inspection system features the tiniest and most robust optical probe available with built-in high-power lighting and a crisp, sharp high-resolution 90-degree viewing angle.
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Coherent Announces Agreement to Sell Aerospace and Defense Business to Advent for $400 Million
08/15/2025 | AdventCoherent Corp., a global leader in photonics, today announced that it has entered into a definitive agreement to sell its Aerospace and Defense business to Advent, a leading global private equity investor, for $400 million. Proceeds will be used to reduce debt, which will be immediately accretive to Coherent’s EPS.
OKI Develops Tiling Crystal Film Bonding (CFB) Technology for Heterogeneous Integration of Optical Semiconductors onto 300 mm Silicon Wafers
08/15/2025 | BUSINESS WIREOKI has successfully developed Tiling crystal film bonding technology using its proprietary CFB technology. This technology makes possible the heterogeneous integration of small-diameter optical semiconductor wafers onto 300 mm silicon wafers, heretofore not possible due to wafer size restrictions, and will contribute to the advancement of rapidly growing photonics-electronics convergence technology.
Point2 Technology, Foxconn Interconnect Technology Partner to Revolutionize AI Cluster Scalability with Terabit-Speed Interconnect
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Teramount Raises $50M to Address Growing Demand for AI Infrastructure Optical Connectivity
07/31/2025 | PRNewswireTeramount, the leader in scalable fiber-to-chip interconnect solutions for AI, data centers and advanced computing, today announced it has raised $50 million in financing led by new investor Koch Disruptive Technologies (KDT). Existing investors Grove Ventures and several new strategic investors, including AMD Ventures, Hitachi Ventures, Samsung Catalyst Fund and Wistron, joined the round.