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See TopLine’s Next Gen Braided Solder Column Technology at SPACE TECH EXPO 2025
May 28, 2025 | TopLineEstimated reading time: 1 minute
Aerospace and Defense applications in demanding environments have a solution now in TopLine’s Braided Solder Columns, which can withstand the rigors of deep space cold and cryogenic environments. They are a robust new ‘Next Gen’ solution to challenges facing large packages in electronics assembly.
On June 3 & 4, Martin Hart, President of TopLine Corporation and holder of multiple patents in the field of electronic components, will exhibit these remarkable breakthrough component solutions at Space Tech Expo 2025 in Long Beach, California in Booth #623.
“Braided Solder Columns are non-collapsible, robust and compliant electrically conductive connectors used for reducing stress caused by CTE mismatch between the component device and the PC board,” Hart says. “Columns are more reliable than solder balls, especially when connecting large-size chip packages to PC Boards operating in cryogenic environments. Additionally, they are available with lead for Aerospace & Defense applications, but also available in lead-free designs for RoHS AI Datacenters, for example.” For more information about the show, visit SPACETECHEXPO.com.
TopLine will also exhibit examples of TANAKA Bonding Wire; TANAKA Precious Metals is the premier manufacturer of bonding wire to the semiconductor industry. TopLine is a supplier of TANAKA bonding wire for many semiconductor uses and for EV applications.
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Klaus Koziol - atgSuggested Items
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