Dan’s Biz Bookshelf: ‘Elevate: Push Beyond Your Limits'
The Marketing Minute: The First Step to More Sales—Marketing
It’s Only Common Sense: Customer Service Is Sales in Disguise
See TopLine’s Next Gen Braided Solder Column Technology at SPACE TECH EXPO 2025
May 28, 2025 | TopLineEstimated reading time: 1 minute
Aerospace and Defense applications in demanding environments have a solution now in TopLine’s Braided Solder Columns, which can withstand the rigors of deep space cold and cryogenic environments. They are a robust new ‘Next Gen’ solution to challenges facing large packages in electronics assembly.
On June 3 & 4, Martin Hart, President of TopLine Corporation and holder of multiple patents in the field of electronic components, will exhibit these remarkable breakthrough component solutions at Space Tech Expo 2025 in Long Beach, California in Booth #623.
“Braided Solder Columns are non-collapsible, robust and compliant electrically conductive connectors used for reducing stress caused by CTE mismatch between the component device and the PC board,” Hart says. “Columns are more reliable than solder balls, especially when connecting large-size chip packages to PC Boards operating in cryogenic environments. Additionally, they are available with lead for Aerospace & Defense applications, but also available in lead-free designs for RoHS AI Datacenters, for example.” For more information about the show, visit SPACETECHEXPO.com.
TopLine will also exhibit examples of TANAKA Bonding Wire; TANAKA Precious Metals is the premier manufacturer of bonding wire to the semiconductor industry. TopLine is a supplier of TANAKA bonding wire for many semiconductor uses and for EV applications.
Share on:
Suggested Items
The Wire Association International’s Wire Expo to Co-Locate with the Electrical Wire Processing Technology Expo (EWPTE)
07/16/2025 | Global Electronics AssociationThe Wire Association International Inc. (WAI) announces plans to co-locate its biennial Wire Expo with the Wiring Harness Manufacturer’s Association (WHMA)/Global Electronics Association’s Electrical Wire Processing Technology Expo (EWPTE) May 6-7, 2026. The two shows will co-locate at the Baird Center, Milwaukee, Wisconsin, USA.
Reshoring Expert to Speak at WHMA Global Leadership Summit
07/16/2025 | Nolan Johnson, I-Connect007The 2026 WHMA Annual Global Leadership Summit offers the tools you need to help your business succeed in this industry that constantly evolves with new technology and practices. WHMA's Annual Global Leadership Summit (formerly the WHMA Annual Conference) is a networking event for executives representing wire harness manufacturers, OEMs, and suppliers to companies that build wiring harnesses and cable assemblies.
Redwire Announces Addition of the Edge Autonomy Stalker Uncrewed Aerial System to DoD’s Blue List of Approved Drones
07/14/2025 | BUSINESS WIRERedwire Corporation, a global leader in aerospace and defense technology solutions, announced that the Stalker uncrewed aerial system (UAS), developed by Redwire’s wholly owned subsidiary Edge Autonomy, has been granted an Authority to Operate (ATO) and is now on the Defense Innovation Unit (DIU) Blue UAS List.
ASMPT Introduces AERO PRO High-Performance Wire Bonder
07/09/2025 | ASMPTASMPT, the world’s leading provider of hardware and software solutions for semiconductor and electronics manufacturing, introduces its latest high-performance wire bonder: the AERO PRO.
KYOCERA AVX Releases New 3DB Hybrid Couplers
07/04/2025 | PRNewswireKYOCERA AVX, a leading global manufacturer of advanced electronic components engineered to accelerate technological innovation and build a better future, released a new line of integrated thin film (ITF) hybrid couplers designed to facilitate the continued evolution of high-frequency wireless systems in industrial, automotive, telecommunications, and telemetry applications.