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Current IssueSales: From Pitch to PO
From the first cold call to finally receiving that first purchase order, the July PCB007 Magazine breaks down some critical parts of the sales stack. To up your sales game, read on!
The Hole Truth: Via Integrity in an HDI World
From the drilled hole to registration across multiple sequential lamination cycles, to the quality of your copper plating, via reliability in an HDI world is becoming an ever-greater challenge. This month we look at “The Hole Truth,” from creating the “perfect” via to how you can assure via quality and reliability, the first time, every time.
In Pursuit of Perfection: Defect Reduction
For bare PCB board fabrication, defect reduction is a critical aspect of a company's bottom line profitability. In this issue, we examine how imaging, etching, and plating processes can provide information and insight into reducing defects and increasing yields.
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CIMS to Exhibit at JPCA Show 2025
May 28, 2025 | CIMSEstimated reading time: Less than a minute
CIMS is excited to announce our participation at JPCA 2025 in Tokyo, Japan! Join us from June 4-6.
We are excited to announce that CIMS will be exhibiting at the Japan Printed Circuit Association (JPCA) Show 2025, the premier event for the PCB industry in Japan. The show will take place in Tokyo from June 4th to 6th, and we invite you to visit us at Booth #5E-01, where we will be co-exhibiting with our partner, Hakuto.
At our booth, we will showcase our cutting-edge Galaxy 5Cx AOI system—a high-precision inspection solution capable of detecting defects down to 5-micron line/space in complex IC substrates, equipped with TrueColor™ image acquisition technology and other latest enhancements. Discover how CIMS’ advanced inspection technologies and smart factory solutions can enhance quality and efficiency for IC substrate manufacturers.
Don’t miss this opportunity to explore the latest innovations—visit us at JPCA 2025!
Testimonial
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Klaus Koziol - atgSuggested Items
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