CIMS to Exhibit at JPCA Show 2025
May 28, 2025 | CIMSEstimated reading time: Less than a minute
CIMS is excited to announce our participation at JPCA 2025 in Tokyo, Japan! Join us from June 4-6.
We are excited to announce that CIMS will be exhibiting at the Japan Printed Circuit Association (JPCA) Show 2025, the premier event for the PCB industry in Japan. The show will take place in Tokyo from June 4th to 6th, and we invite you to visit us at Booth #5E-01, where we will be co-exhibiting with our partner, Hakuto.
At our booth, we will showcase our cutting-edge Galaxy 5Cx AOI system—a high-precision inspection solution capable of detecting defects down to 5-micron line/space in complex IC substrates, equipped with TrueColor™ image acquisition technology and other latest enhancements. Discover how CIMS’ advanced inspection technologies and smart factory solutions can enhance quality and efficiency for IC substrate manufacturers.
Don’t miss this opportunity to explore the latest innovations—visit us at JPCA 2025!
Suggested Items
INSPECTIS AB ‘Makes it a Meal’ with Series U50s Advanced Kit
07/18/2025 | INSPECTIS ABFamous chefs the world over maintain that an entrée doesn’t make a great meal without side dishes. At INSPECTIS, we call those ‘sides’ an Advanced Kit.
From Pitch to PO: The Sales Stack
07/18/2025 |Though all parts of a company are essential for holistic success, it is a foundational truth that a company lives and dies by its sales. If there are no sales, the company eventually ceases to exist, or as this quote attributed to Henry Ford says, “Nothing happens until someone sells something.” This is the July issue of PCB007 Magazine, where we break down the sales stack and provide a guide to up your sales game.
Silicon Mountain Contract Services Enhances SMT Capabilities with New HELLER Reflow Oven
07/17/2025 | Silicon Mountain Contract ServicesSilicon Mountain Contract Services, a leading provider of custom electronics manufacturing solutions, is proud to announce a significant upgrade to its SMT production capability with the addition of a HELLER 2043 MK5 10‑zone reflow oven to its Nampa facility.
KONIG Launches KP400: Advanced 3D Digital Conformal Coating System for High-Density Electronics
07/15/2025 | KONIGKONIG, a leader in electronic packaging protection solutions, is proud to announce the launch of the KP400 3D Digital Packaging Solution—a breakthrough conformal coating system that brings new levels of precision, speed, and material efficiency to electronics manufacturing.
Electronics Manufacturing & Assembly Collaborative (EMAC) Announces Innovative Student Competition
07/15/2025 | EMACThe Electronics Manufacturing & Assembly Collaborative (EMAC) recently announced the launch of the Bright Manufacturing Challenge 2025, a revolutionary hands-on competition that transforms how students experience electronics manufacturing and robotics engineering.