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Advanced Electronics Packaging Digest

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Zhen Ding Highlights AI and Global Mass Production in Advanced PCB Competition

10/23/2026 | Zhen Ding Technology
Zhen Ding Technology Holding Limited, a global leader in PCB manufacturing, participated in the “TPCA Show Trends Forum” at the 2026 TPCA Show.

Rehm Thermal Systems Strengthens Its Presence in Spain and Portugal: Propelec Appointed as New Representative

10/14/2026 | Rehm Thermal Systems
Rehm Thermal Systems is expanding its sales activities in the Spanish and Portuguese markets and has appointed Propelec S.L. as its new representative for the Protecto and RDS UV LED product ranges.

3 Key Takeaways: Making ENIG and ENEPIG More Sustainable

09/30/2026 | I-Connect007
Gold prices have risen dramatically over the past decade, putting additional pressure on PCB fabricators to control costs without compromising the finishes their customers require. For ENIG and ENEPIG processes, however, the opportunity to reduce costs may also present an opportunity to improve sustainability. In its white paper, “Can ENIG & ENEPIG Process be Sustainable?” MacDermid Alpha Electronics Solutions provides guidelines for where the greatest opportunities exist to reduce gold consumption, chemistry use, energy demand, and waste while continuing to meet established performance requirements.

LPMS USA to Highlight Local Supply and Simplified Electronics Protection at SMTA Guadalajara

09/17/2026 | LPMS USA
LPMS USA, a leading provider of integrated low pressure molding solutions for electronics protection, will exhibit at the SMTA Guadalajara Expo & Tech Forum, October 7–8, 2026, at Expo Guadalajara.

Incap Rocks World Tour Begins with a Look at the Changing Automotive Industry

09/09/2026 | Incap
The Incap Rocks World Tour begins in Slovakia with a discussion on an industry undergoing significant technological change: automotive.
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