Dan’s Biz Bookshelf: ‘Elevate: Push Beyond Your Limits'
The Marketing Minute: The First Step to More Sales—Marketing
It’s Only Common Sense: Customer Service Is Sales in Disguise
Zhen Ding Releases April 2025 Monthly Revenue Report
May 7, 2025 | Zhen Ding TechnologyEstimated reading time: Less than a minute
Zhen Ding Technology Holding Limited, a global leading PCB manufacturer, reported April 2025 revenue of NT$13,589 million, up 22.90% YoY, marking a record high for the same period in the company’s history. For January through April 2025, cumulative revenue reached NT$53,671 million, up 23.19% YoY, also setting a new record for the same period. These results demonstrate the company’s strong capability to maintain steady growth amid rising macroeconomic uncertainties.
According to Zhen Ding, April revenue maintained strong YoY growth, with IC Substrates showing the highest revenue growth among its four major applications, increasing by nearly 50% YoY. This was followed by Computers and Consumer Electronics segment and Mobile Communications, both achieving over 20% YoY revenue growth. While the evolving global political and economic conditions as well as fluctuations of exchange rates have posed challenges to the supply chain, Zhen Ding will continue to strengthen its global footprint and operational resilience. The company remains committed to delivering above-industry-average growth across key application areas including IC substrates, edge AI, AI servers, and optical modules, with the goal of achieve another record-high revenue this year.
Share on:
Suggested Items
Silicon Mountain Contract Services Enhances SMT Capabilities with New HELLER Reflow Oven
07/17/2025 | Silicon Mountain Contract ServicesSilicon Mountain Contract Services, a leading provider of custom electronics manufacturing solutions, is proud to announce a significant upgrade to its SMT production capability with the addition of a HELLER 2043 MK5 10‑zone reflow oven to its Nampa facility.
KONIG Launches KP400: Advanced 3D Digital Conformal Coating System for High-Density Electronics
07/15/2025 | KONIGKONIG, a leader in electronic packaging protection solutions, is proud to announce the launch of the KP400 3D Digital Packaging Solution—a breakthrough conformal coating system that brings new levels of precision, speed, and material efficiency to electronics manufacturing.
Electronics Manufacturing & Assembly Collaborative (EMAC) Announces Innovative Student Competition
07/15/2025 | EMACThe Electronics Manufacturing & Assembly Collaborative (EMAC) recently announced the launch of the Bright Manufacturing Challenge 2025, a revolutionary hands-on competition that transforms how students experience electronics manufacturing and robotics engineering.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
07/11/2025 | Andy Shaughnessy, Design007 MagazineThis week, we have quite a variety of news items and articles for you. News continues to stream out of Washington, D.C., with tariffs rearing their controversial head again. Because these tariffs are targeted at overseas copper manufacturers, this news has a direct effect on our industry.I-Connect007 Editor’s Choice: Five Must-Reads for the Week
Infineon Advances on 300-millimeter GaN Manufacturing Roadmap as Leading Integrated Device Manufacturer (IDM)
07/10/2025 | InfineonAs the demand for gallium nitride (GaN) semiconductors continues to grow, Infineon Technologies AG is poised to capitalize on this trend and solidify its position as a leading Integrated Device Manufacturer (IDM) in the GaN market.