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Advanced Electronics Packaging Digest

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Stay ahead of the technologies shaping the future of electronics with our latest newsletter, Advanced Electronics Packaging Digest. Get expert insights on advanced packaging, materials, and system-level innovation, delivered straight to your inbox.

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4D_Additive Software Introduces New Industrial 3D Printing Workflow

08/16/2026 | CoreTechnologie
CoreTechnologie optimizes its 4D_Additive 3D printing software with a new Build History, automated data preparation, and enhanced functions for SLM supports and lattice structures.

Renesas Promotes Gaurang Shah to Senior Vice President

06/26/2026 | Renesas
Renesas Electronics Corporation, a premier supplier of advanced semiconductor solutions, announced that Gaurang Shah will be promoted to Senior Vice President, effective July 1, 2026.

TSMC Accelerates CoPoS Development; Taiwan Suppliers Leverage FOPLP for Glass Core Substrates

06/17/2026 | TrendForce
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HFR Accelerates GPU-Based AI-RAN Development with ETRI

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Market Insights with Pluritec's Maurizio Bonati

04/23/2026 | Real Time with... APEX EXPO
Nolan Johnson interviews Maurizio Bonati, VP of Sales at Pluritec, at APEX EXPO 2026. Bonati details Pluritec's three product divisions, covering a broad spectrum of PCB manufacturing. He discusses the current robust electronics market, driven by AI applications in Asia and technological investments in North America, while noting slower demand in Europe. The interview highlights key sectors like data centers, AI, and medical that benefit from advanced electronics.
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