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Advanced Electronics Packaging Digest

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Stay ahead of the technologies shaping the future of electronics with our latest newsletter, Advanced Electronics Packaging Digest. Get expert insights on advanced packaging, materials, and system-level innovation, delivered straight to your inbox.

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Suggested Items

Global Electronics Association's ADEPT Council Deepens Taiwan Presence as First Satellite Council Holds Inaugural In-Person Meeting

10/23/2026 | Global Electronics Association
The Global Electronics Association's Advanced Electronic Packaging Technology (ADEPT) Leadership Council is deepening its presence in Taiwan.

HDP, Global Electronics Association Release New Copper Foil Profile Test Method

10/19/2026 | HDP User Group
High Density Packaging User Group (HDP) and the Global Electronics Association are pleased to announce the release of a new test method, IPC-TM-650-2.2.23, based on the results of HDP’s Non-Contact Copper Foil Profile project.

GlobalFoundries Marks Dresden Expansion, Unveils Physical AI Platform

10/16/2026 | GlobalFoundries
GlobalFoundries celebrated the topping-out of its SPRINT expansion project in Dresden and announced FDX Fusion, a next-generation platform for highly integrated, energy-efficient chips planned for development and manufacturing at the site.

SIA Applauds GlobalFoundries Expansion Under U.S.-Japan Initiative

10/15/2026 | SIA
The Semiconductor Industry Association (SIA) released the following statement from SIA President and CEO Michael Robbins applauding the selection of GlobalFoundries to operate two new semiconductor manufacturing facilities in Malta, NY.

GlobalFoundries Selected to Operate Two New York Fabs Under US-Japan Initiative

10/15/2026 | Globe Newswire
GlobalFoundries announced it has been selected as the technology provider and operator for two new semiconductor manufacturing facilities (fabs) at its Malta, New York, site under a U.S.-Japan initiative providing up to $21 billion in funding.
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