Nolan's Notes: The Next Killer App in Component Manufacturing
The Knowledge Base: Unlocking the Invisible—The Critical Role of X-ray Technology
Standard of Excellence: Turning Negative Customer Feedback Into Positive Outcomes
AIM Solder and India’s Persang Alloy Industries Announce Strategic Joint Venture
April 10, 2025 | AIM SolderEstimated reading time: Less than a minute
AIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce its participation in the upcoming SMTA Wisconsin Expo & Tech Forum taking place on May 6 at the Crowne Plaza Milwaukee Airport, in Milwaukee, WI. AIM will be showcasing its cutting-edge soldering materials, including Type 5 solder paste offerings.
In celebration of emerging trends in electronics miniaturization, AIM is declaring 2025 the "Year of Type 5". With decades of experience producing high-quality solder pastes, including Types 4, 5, and 6, AIM is uniquely positioned to guide customers through the transition to finer powders. AIM products are developed with a focus on consistency, reliability, and process optimization, and are then coupled with robust technical support. While Type 5 solder paste won’t replace Type 4 as the industry standard this year, its adoption is accelerating, driven by demand for precise, consistent soldering.
To learn more about AIM’s solder paste offerings and to discover all of AIM’s products and services, visit the company at the SMTA Wisconsin Expo & Tech Forum on May 6th.
Share on:
Suggested Items
Indium’s Karthik Vijay to Present on Dual Alloy Solder Paste Systems at SMTA’s Electronics in Harsh Environments Conference
05/06/2025 | Indium CorporationIndium Corporation Technical Manager, Europe, Africa, and the Middle East Karthik Vijay will deliver a technical presentation on dual alloy solder paste systems at SMTA’s Electronics in Harsh Environments Conference, May 20-22 in Amsterdam, Netherlands.
SolderKing Achieves the Prestigious King’s Award for Enterprise in International Trade
05/06/2025 | SolderKingSolderKing Assembly Materials Ltd, a leading British manufacturer of high-performance soldering materials and consumables, has been honoured with a King’s Award for Enterprise, one of the UK’s most respected business honours.
'Chill Out' with TopLine’s President Martin Hart to Discuss Cold Electronics at SPWG 2025
05/02/2025 | TopLineBraided Solder Columns can withstand the rigors of deep space cold and cryogenic environments, and represent a robust new solution to challenges facing next generation large packages in electronics assembly.
BEST Inc. Reports Record Demand for EZReball BGA Reballing Process
05/01/2025 | BEST Inc.BEST Inc., a leader in electronic component services, is pleased to announce they are experiencing record demand for their EZReball™ BGA reballing process which greatly simplifies the reballing of ball grid array (BGA) and chip scale package (CSP) devices.
Indium Wins EM Asia Innovation Award
05/01/2025 | Indium CorporationIndium Corporation, a leading materials provider for the electronics assembly market, recently earned an Electronics Manufacturing (EM) Asia Innovation Award for its new high-reliability Durafuse® HR alloy for solder paste at Productronica China in Shanghai.