Smart Automation: What Industry 4.0 Means for Mid-sized Electronics Manufacturing
Global Sourcing Spotlight: Risk Management Strategies in Global Sourcing
The Government Circuit: Three Inescapable Conclusions About Global Trade Policies
'Chill Out' with TopLine’s President Martin Hart to Discuss Cold Electronics at SPWG 2025
May 2, 2025 | TopLineEstimated reading time: Less than a minute
Braided Solder Columns can withstand the rigors of deep space cold and cryogenic environments, and represent a robust new solution to challenges facing next generation large packages in electronics assembly. On May 6, Martin Hart, President of TopLine Corporation and holder of multiple patents in the field of electronic components, will present “Braided Solder Columns for Cold Electronics - Moon, Mars and Beyond” at the SPACE PARTS WORKING GROUP (SPWG) 2025, an international forum in El Segundo, California, to disseminate information to the aerospace industry and to resolve problems with high-reliability electronic piece parts needed for space and missile applications. In-person attendance will be held at The Aerospace Corporation, 210 S. Douglas Street, El Segundo, CA 90245.
“Braided Solder Columns are non-collapsible, robust and compliant structures used for reducing stress caused by CTE mismatch,” Hart says. “Columns are more reliable than solder balls, especially when connecting large-size chip packages to PC Boards operating in cryogenic environments. Additionally, they are available with lead for Aerospace & Defense applications, but also available in lead-free designs for RoHS AI Datacenters, for example.”
Share on:
Testimonial
"We’re proud to call I-Connect007 a trusted partner. Their innovative approach and industry insight made our podcast collaboration a success by connecting us with the right audience and delivering real results."
Julia McCaffrey - NCAB GroupSuggested Items
Weller Tools Supports Future Talent with Exclusive Donation to SMTA Michigan Student Soldering Competition
07/23/2025 | Weller ToolsWeller Tools, the industry leader in hand soldering solutions, is proud to announce its support of the upcoming SMTA Michigan Expo & Tech Forum by donating a limited-edition 80th Anniversary Black Soldering Set to the event’s student soldering competition.
Koh Young Appoints Tom Hattori as President of Koh Young Japan
07/21/2025 | Koh YoungKoh Young Technology, the global leader in True 3D measurement-based inspection solutions, announced the appointment of Tom Hattori as President of Koh Young Japan (JKY).
Silicon Mountain Contract Services Enhances SMT Capabilities with New HELLER Reflow Oven
07/17/2025 | Silicon Mountain Contract ServicesSilicon Mountain Contract Services, a leading provider of custom electronics manufacturing solutions, is proud to announce a significant upgrade to its SMT production capability with the addition of a HELLER 2043 MK5 10‑zone reflow oven to its Nampa facility.
Knocking Down the Bone Pile: Addressing End-of-life Component Solderability Issues, Part 4
07/16/2025 | Nash Bell -- Column: Knocking Down the Bone PileIn 1983, the Department of Defense identified that over 40% of military electronic system failures in the field were electrical, with approximately 50% attributed to poor solder connections. Investigations revealed that plated finishes, typically nickel or tin, were porous and non-intermetallic.
SHENMAO Strengthens Semiconductor Capabilities with Acquisition of PMTC
07/10/2025 | SHENMAOSHENMAO America, Inc. has announced the acquisition of Profound Material Technology Co., Ltd. (PMTC), a premier Taiwan-based manufacturer of high-performance solder balls for semiconductor packaging.