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Indium Corporation Technical Manager, Europe, Africa, and the Middle East Karthik Vijay will deliver a technical presentation on dual alloy solder paste systems at SMTA’s Electronics in Harsh Environments Conference, May 20-22 in Amsterdam, Netherlands.
The presentation, Engineering Dual Alloy Solder Paste Systems to Achieve High Reliability, Energy Savings, and to Withstand High Junction Temperatures, will highlight dual alloy solder paste systems that were developed with engineered alloy ratios (with multiple elements per alloy) to incorporate multiple characteristics in the final solder joint. These characteristics include achieving the right balance of hardness and ductility, allowing for increased wetting and low voiding, eliminating low melt intermetallic phases (associated with a single alloy system), and achieving energy efficiency and reliability with lower peak process temperature (<210°C).
“Dual alloy solder paste systems allow for greater application versatility compared to single solder alloy systems, which can typically only go in one direction, such as having either a higher melting point or a lower melting point,” said Vijay. “This presentation will examine how dual alloy solder paste systems are particularly well suited to the assembly of reliable electronics for use in both power electronics and harsh environment applications.”
Vijay is responsible for technology programs and technical support for Indium Corporation’s customers in Europe, Africa, and the Middle East. Previously, he was responsible for applications support for the company’s customers on the North American West Coast. His expertise spans automotive, industrial, and RF applications involving PCBA and power electronics with a focus on using different material sets, including solder preforms, solder paste, thermal interface materials, and semiconductor-grade electronics materials.
With more than 20 years of experience in electronics assembly, Vijay has delivered presentations on critical challenges facing the industry at trade shows, including events hosted by IMAPS and SMTA, and private customer conferences,
The presentation will take place on Wednesday, May 21, at 4:15 p.m.
