-
- News
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueSales: From Pitch to PO
From the first cold call to finally receiving that first purchase order, the July PCB007 Magazine breaks down some critical parts of the sales stack. To up your sales game, read on!
The Hole Truth: Via Integrity in an HDI World
From the drilled hole to registration across multiple sequential lamination cycles, to the quality of your copper plating, via reliability in an HDI world is becoming an ever-greater challenge. This month we look at “The Hole Truth,” from creating the “perfect” via to how you can assure via quality and reliability, the first time, every time.
In Pursuit of Perfection: Defect Reduction
For bare PCB board fabrication, defect reduction is a critical aspect of a company's bottom line profitability. In this issue, we examine how imaging, etching, and plating processes can provide information and insight into reducing defects and increasing yields.
- Articles
- Columns
- Links
- Media kit
||| MENU - pcb007 Magazine
Cyient Announces the Launch of Semiconductor Subsidiary
April 8, 2025 | PRNewswireEstimated reading time: 1 minute
Cyient, a leading global engineering and technology solutions company, announced the launch of its fully owned semiconductor subsidiary, Cyient Semiconductors. This strategic move strengthens the company's commitment to innovation and excellence across the global semiconductor landscape.
By carrying forward Cyient's expertise in semiconductor design, Cyient Semiconductors will focus on scaling Application-Specific Integrated Circuit (ASIC) turnkey solutions for customers. For more than 25+ years, Cyient has been delivering comprehensive ASIC turnkey solutions and semiconductor design services across industrial, data center applications, automotive, and medical. Driven by strategic organic and inorganic growth, Cyient Semiconductors has built high-performance teams across India, the U.S., Germany, Belgium, the Netherlands, and Taiwan.
"Our vision is to align Cyient's semiconductor capabilities with the national agenda set by the Ministry of Electronics and Information Technology, aiming to build a robust semiconductor ecosystem in India. With the growing demand for high-performance semiconductor solutions, Cyient Semiconductors will play a crucial role in providing end-to-end ASIC turnkey and IC design services, supporting India's journey toward self-reliance in the semiconductor ecosystem," said Krishna Bodanapu, Executive Vice Chairman & Managing Director, Cyient.
"I am also happy to share that we have appointed Suman Narayan as the CEO of Cyient Semiconductors. Suman is an accomplished professional in the semiconductor space with a proven track record of managing large organizations, scaling semiconductor businesses, and driving digital transformation. His expertise in semiconductor products and ASIC development will be instrumental in shaping the future of Cyient Semiconductors," he added.
The semiconductor market is valued at approximately $600 billion and is projected to reach $2 trillion by 2032. The new subsidiary will tap into this high-growth opportunity, focusing on developing fabless semiconductor solutions while addressing the increasing demand for specialized semiconductor expertise.
"India is on the cusp of a semiconductor revolution, and Cyient is well-positioned to be at the forefront of this transformation," said Suman Narayan, CEO of Cyient Semiconductors.
"With our deep domain expertise, we will continue to empower global and domestic clients with high-value solutions. We firmly believe that the new semiconductor subsidiary will drive next-generation innovations meeting the requirements of our customers," he added.
Cyient's strong IP portfolio, deep domain expertise, long-standing customer partnerships, and global capabilities will give Cyient Semiconductors the strategic edge to achieve significant growth.
Suggested Items
Tata Electronics, Bosch Sign MoU for Strategic Collaboration in Electronics and Semiconductor Manufacturing
07/18/2025 | Tata ElectronicsTata Electronics, a leading player in the Indian electronics and semiconductor manufacturing sector, and Robert Bosch GmbH, a leading global supplier of technology and services, announced that they have signed a Memorandum of Understanding (MoU) to collaborate on several key areas within the electronics and semiconductor industries.
Fraunhofer IPMS, DIVE Optimize Semiconductor Processes with Cutting-Edge Measurement System
07/17/2025 | Fraunhofer IPMSThe Fraunhofer Institute for Photonic Microsystems IPMS, in collaboration with DIVE imaging systems GmbH, has achieved a major milestone in resource-efficient semiconductor manufacturing.
TI Honored by Volkswagen Group for Operational Excellence
07/16/2025 | Texas InstrumentsTexas Instruments (TI) received the prestigious “Operational Excellence” award at the annual Volkswagen Group Award 2025 in Wolfsburg, Germany.
Report: Broadcom Scraps $1 Billion Chip Investment in Spain
07/15/2025 | I-Connect007 Editorial TeamAmerican chipmaker Broadcom has pulled out of plans to invest in a microchip plant in Spain. According to a July 14 Reuters report, Europa Press, quoting anonymous sources, stated the action followed collapsed government talks but gave no further information.
Siemens Collaborates with SK keyfoundry to Launch 130nm Automotive Power Semiconductor Calibre PERC PDK
07/15/2025 | SiemensSiemens Digital Industries Software announced that SK keyfoundry, in collaboration with Korea Siemens EDA, has launched a 130nm automotive PDK (Process Design Kit) that is exclusively designed for use in Calibre® PERC™ software.