-
-
News
News Highlights
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueVoices of the Industry
We take the pulse of the PCB industry by sharing insights from leading fabricators and suppliers in this month's issue. We've gathered their thoughts on the new U.S. administration, spending, the war in Ukraine, and their most pressing needs. It’s an eye-opening and enlightening look behind the curtain.
The Essential Guide to Surface Finishes
We go back to basics this month with a recount of a little history, and look forward to addressing the many challenges that high density, high frequency, adhesion, SI, and corrosion concerns for harsh environments bring to the fore. We compare and contrast surface finishes by type and application, take a hard look at the many iterations of gold plating, and address palladium as a surface finish.
It's Show Time!
In this month’s issue of PCB007 Magazine we reimagine the possibilities featuring stories all about IPC APEX EXPO 2025—covering what to look forward to, and what you don’t want to miss.
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - pcb007 Magazine
Increase in Share Capital and Number of Shares in HANZA
April 3, 2025 | HANZAEstimated reading time: Less than a minute
On March 3, HANZA completed the acquisition of Leden Group Oy. Part of the purchase price consisted of 2,300,000 newly issued shares in HANZA AB. The issue was registered by the Swedish Companies Registration Office on March 4.
The company's registered share capital thus increased by SEK 230,000 and amounts to SEK 4,595,934. The total number of shares in HANZA AB as of March 31, 2025, the last trading day of the month, amounts to 45,959,340. Only one share class exists.
Suggested Items
2024 Global Semiconductor Materials Market Posts $67.5 Billion in Revenue
04/29/2025 | SEMIGlobal semiconductor materials market revenue increased 3.8% to $67.5 billion in 2024, SEMI, the global industry association representing the electronics design and manufacturing supply chain, reported in its Materials Market Data Subscription (MMDS).
New RF Materials Offer Options for RF Designers
04/29/2025 | Andy Shaughnessy, Design007 MagazineThe RF materials arena has changed quite a bit in the past decade. The newest thermoset laminates boast performance numbers that are almost competitive with PTFE, but without the manufacturability challenges. At IPC APEX EXPO this year, I spoke with Brent Mayfield, business development manager at AGC Multi Material America. Brent walked through some recent innovations in RF materials, advances in resin systems, and the many design trade-offs for RF engineers to consider for each material set.
Real Time with... IPC APEX EXPO 2025: Winner of the IPC Best Student Poster Award
04/29/2025 | Real Time with...IPC APEX EXPOSebastian Carrillo, winner of the Best Student Technical Poster Award, shares insights on his research in nanotechnology and plasmonics. His work on a metal insulator nano array focuses on light-matter interactions at the nanoscale. With advancements in manufacturing, applications include sensing technologies and photovoltaic systems. Sebastian discusses his project involving simulations and optical experiments. His career goals are in research, and he encourages students to seize academic opportunities.
New IPC Standard Sets First Global Benchmark for E-Textile Wearable Reliability
04/29/2025 | IPCIPC announces the release of IPC-8981, Quality and Reliability of E-Textile Wearables. This first-of-its-kind standard sets baselines for testing and classifying e-textile wearables, addressing key challenges in product reliability, performance, and quality assurance.
Rising Star Award: Paavo Niskala, TactoTek
04/28/2025 | Nolan Johnson, I-Connect007Paavo Niskala joined the IPC community in 2022 as part of the inaugural steering group for in-mold electronics. He led the development of standard IPC-8401, Guidelines for In-Mold Electronics, chairing the project from its inception to its publication in 2024. Currently, Paavo serves as vice chair of the D-84A Plastronics Accelerated Reliability Testing Task Group, contributing his expertise to advancing reliability standards in the field.