The Marketing Minute: A Brand Visibility Playbook—Get Seen, Heard, and Remembered
American Made Advocacy: Supporting the Entire PCB Ecosystem—Materials to OEMs
Marcy's Musings: The Hole Truth—Via Integrity in an HDI World
Indium to Showcase Innovative Materials Powering AI Technology at Productronica China
March 25, 2025 | Indium CorporationEstimated reading time: 1 minute
As a proven leader in Metal-Based Thermal Interface materials solutions for future-forward technologies, Indium Corporation will proudly showcase its portfolio of thermal interface materials (TIMs) that enabling AI advancements at Productronica China, March 26-28, in Shanghai, China.
Indium Corporation’s GalliTHERM® portfolio of gallium-based liquid metal solutions builds on more than 60 years of expertise in manufacturing advanced gallium-based materials. Designed for both TIM¹ and TIM² applications, these liquid metal TIMs offer cutting-edge thermal interface performance with superior reliability. Liquid metal TIMs offer:
- High thermal conductivity versus polymers
- High purity enables excellent wetting to surfaces
- No soldering or surface metallization needed
Indium Corporation’s Solder Thermal Interface Materials deliver superior heat dissipation and high thermal conductance for power-dense devices. Indium has a high bulk thermal conductivity (86 W/m-K) which means less sensitivity to bond line thicknesses and coplanarity issues compared to polymeric TIMs. Indium’s ductility can accommodate differential thermal expansion with minimal stress on the interface making Solder TIM an ideal TIM1 or TIM1.5 where die or substrate warpage and CTE mismatch challenges are present.
Indium Corporation’s Heat-Spring® solutions provide an optimal TIM2 solution as a compressible, non-reflow metal TIM. In liquid immersion systems, Heat-Spring® is also a proven TIM compatible with all major immersion fluids that will not dissolve in Single–Phase or Two-Phase immersion cooling liquids. These indium-based TIMs deliver outstanding thermal conductivity compared to non-metal alternatives—with pure indium metal achieving 86 W/m·K in all directions. Due to its solid metal state, Heat-Spring® effectively prevents pump-out and bake-out issues while also supporting sustainability through Indium Corporation’s reclaim and recycle program.
Share on:
Suggested Items
Day 2: More Cutting-edge Insights at the EIPC Summer Conference
06/18/2025 | Pete Starkey, I-Connect007The European Institute for the PCB Community (EIPC) summer conference took place this year in Edinburgh, Scotland, June 3-4. This is the third of three articles on the conference. The other two cover Day 1’s sessions and the opening keynote speech. Below is a recap of the second day’s sessions.
Ventec Strengthens Commitment to Halogen-Free PCB Manufacturing in Europe
06/11/2025 | Ventec International GroupVentec International Group, the PCB materials innovator, manufacturer, supplier and one-stop shop for copper clad laminates, prepregs, as well as process consumables and PCB manufacturing equipment has established volume inventory of halogen-free FR4.1 and FR15.1 PCB materials at its European hub in Germany.
GEN3 Set to Host HATS²™ Technical Day at A.W. Technical Centre with Bob Neves
06/09/2025 | Gen3GEN3, a global leader in reliability testing and measurement solutions for the electronics industry, is excited to announce a dedicated HATS²™ Technical Day to be held at the A.W. Technical Centre in Farnborough, GEN3’s HQ. The event will showcase the HATS²™ (Highly Accelerated Thermal Shock) system with demos and presentations by Bob Neves, Chairman of RAS Inc. and creator of the HATS²™.
Rehm Thermal Systems Mexico: Ten Years of Growth and Innovation in an Emerging Market
06/03/2025 | Rehm Thermal SystemsOver ten years ago, Luis A. Garcia began his success story at Rehm Thermal Systems. On May 15, 2013, he initially joined as a member of the Rehm USA team.
2025 COMPUTEX Compal Unveils 'The Race is On' Strategy During Forum Session
05/23/2025 | Compal Electronics Inc.As AI models and computing density continue to grow at an exponential rate, the data center industry is entering a new era where cooling capacity has become the next competitive threshold.