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Zhen Ding Reported Its Operating Results for the Full Year of 2024, Expecting AI Applications to Drive Growth in 2025
March 17, 2025 | Zhen Ding TechnologyEstimated reading time: Less than a minute
Zhen Ding Technology Holding Limited, a global leading PCB manufacturer, hosted an investor conference and announced its consolidated financial results for the full year of 2024. Revenue for 2024 was NT$171,664 million, reaching a record high in the company’s history and maintaining the company’s position as the world’s largest PCB manufacturer for the eighth consecutive year. The full-year net income was NT$13,096 million, net income to parent was NT$9,180 million, and EPS was NT$9.67.
According to Chairman & Group Chief Strategy Officer (Group CSO) Charles Shen, Zhen Ding’s 2024 revenue increased by 13.4% YoY, exceeding previous expectations and setting a new historical record. The company's global PCB market share further increased from 7.0% in the previous year to 7.3%, and it remains committed to its mid-to-long-term growth strategy. Among Zhen Ding’s four major applications, revenue for Mobile Communications, Servers/Automotive/Optical, and IC Substrates all achieved record highs, while Computers and Consumer Electronics also showed a significant recovery. Benefiting from a better product mix and improved production efficiency, its gross margin for 2024 reached 18.9% and operating margin reached 6.8%, both delivering year-on-year improvements.
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Global Semiconductor Equipment Billings Surged to $117 Billion in 2024
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Gartner Says Worldwide Semiconductor Revenue Grew 21% in 2024
04/10/2025 | Gartner, Inc.Worldwide semiconductor revenue totaled $655.9 billion in 2024, up 21% from $542.1 billion in 2023, according to final results by Gartner, Inc. NVIDIA climbed to the No. 1 position, overtaking Samsung Electronics and Intel for the first time.
Real Time With... IPC APEX EXPO 2025: Best Student Technical Paper Winner—Attila Rektor
04/10/2025 | Marcy LaRont, I-Connect007Attila Rektor, a Ph.D student from Boise State, won the best technical paper award at IPC APEX EXPO 2025. His paper explores enhancing the conductivity of laser-induced graphene for flexible circuits. The research, funded by SAIC, involved modulating surface energy to enable effective copper plating. This breakthrough has potential applications in flexible printed circuit boards, sensing, and biomedical devices.