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The Essential Guide to Surface Finishes
We go back to basics this month with a recount of a little history, and look forward to addressing the many challenges that high density, high frequency, adhesion, SI, and corrosion concerns for harsh environments bring to the fore. We compare and contrast surface finishes by type and application, take a hard look at the many iterations of gold plating, and address palladium as a surface finish.
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PCB007 Magazine: The Essential Guide to Surface Finishes—March 2025
March 17, 2025 | I-Connect007 Editorial TeamEstimated reading time: Less than a minute

The Essential Guide to Surface Finishes
Corrosion, adhesion, bonding—the comprehensive issue of surface finish plating is a primary one for printed circuit board manufacturers and their assembly counterparts with gold as the “gold standard” for many applications. But gold is expensive, and it has its limits.
In the March 2025 issue of PCB007 Magazine, we compare and contrast surface finishes by type and application, taking a hard look at the many iterations of gold plating as a longtime standard and as palladium as a surface finish. We also take another look at a compelling additive manufacturing metallization product and technology. We go back to basics, recount a little history, and look forward to addressing the many challenges that high density, high frequency, adhesion, SI, and corrosion concerns for harsh environments bring to the fore.
Suggested Items
Observations on Palladium as a Final Finish
04/04/2025 | Happy Holden, I-Connect007Not much has been published about palladium as a final finish, but it’s experiencing a renaissance as a liquid metal for metallization of copper in ultra HDI and as a final finish. It was very popular in the 1970s because of its corrosion resistance, as the only other final finishes were tin-lead reflow, Ni/Au, OSP, or immersion tin. Palladium was very popular with the automotive industry then and Photocircuits of Glen Cove, New York, was a major supplier of boards.
Uyemura Announces Six Sigma Graduates
04/02/2025 | UyemuraDr. Patrick Valentine, Technical & Lean Six Sigma Manager and Six Sigma Master Black Belt, announces the completion of Lean Six Sigma Black Belt training by 4 members of Uyemura’s professional staff.
Gold as a Key Component in PCBs and IC Substrates
03/20/2025 | Britta Schafsteller, Sandra Nelle, and Kuldip Johal, MKS' AtotechGold has long been a cornerstone in the electronics industry, particularly in the surface finishing of PCBs and IC substrates. It provides essential surface protection while enabling various assembling techniques, such as soldering connections and wire bonding, using aluminum, gold, or copper wires.
SAMI-AEC Earns Gold Membership Under “Made in Saudi” Program
03/19/2025 | SAMISAMI Advanced Electronics Company (SAMI-AEC) proudly announces its elevation to the prestigious Gold Category within the “Made in Saudi” program.
ICT Spring Seminar: Nickel Not Welcome Here
03/12/2025 | Pete Starkey, I-Connect007After a miserable, dull, and damp English winter, a really pleasant nearly spring day with the sun shining and daffodils in bloom greeted delegates to the Institute of Circuit Technology Spring Seminar at Puckrup Hall near Tewkesbury, March 5, in Gloucestershire, UK.