Share on:

Share on LinkedIn Share on X Share on Facebook Share with email

Suggested Items

Baker Hughes' Waygate Unveils Nanotom HR for Advanced Inspection

05/06/2025 | Baker Hughes
Waygate Technologies, a Baker Hughes business and global leader in nondestructive testing (NDT) solutions for industrial inspection, unveiled its new extremely high-resolution computed tomography (CT) system, Phoenix Nanotom® HR (High Resolution) at the Control 2025 show in Stuttgart, Germany.

Libra Industries Boosts SMT and Electronics Manufacturing Capabilities in Dallas, Texas

05/06/2025 | Libra Industries
Libra Industries is excited to announce the latest upgrades to its surface mount technology (SMT) capabilities at its Dallas, Texas facility.

Koh Young Invites You to the 2025 IEEE Electronic Components and Technology Conference

05/06/2025 | Koh Young
Koh Young, the industry leader in True3D™ measurement-based inspection solutions, invites you to join us at the 2025 IEEE Electronic Components and Technology Conference (ECTC), taking place May 27–30, 2025, at the Gaylord Texan Resort & Convention Center in Grapevine, Texas

Happy’s Tech Talk #38: Novel Metallization for UHDI

05/07/2025 | Happy Holden -- Column: Happy’s Tech Talk
I have been involved in high-density electronics substrates since 1970 when I joined Hewlett-Packard’s RF semiconductor group after college. Figure 1 shows the difference between trace/space lithography for substrates and silicon starting in 1970. My projects involved sapphire circuits for RF devices, but the figure displays the state of PCBs and integrated CMOS circuits and their packaging, not discreet RF devices. Even then, semiconductors were 50X higher density.

SEMICON Europa 2025 Call for Abstracts Opens for Advanced Packaging Conference and MEMS & Imaging Summit

05/05/2025 | SEMI
SEMI Europe announced the opening of the call for abstracts for SEMICON Europa 2025, to be held November 18-21 at Messe München in Munich, Germany. Selected speakers will share their expertise at the Advanced Packaging Conference (APC), MEMS & Imaging Sensors Summit, and during presentations on the show floor.
Copyright © 2025 I-Connect007 | IPC Publishing Group Inc. All rights reserved. Log in