Trouble in Your Tank: Organic Addition Agents in Electrolytic Copper Plating
Marcy’s Musings: Can You Hear the Voices?
The Marketing Minute: Strategic Short-form Content Builds Brand Momentum
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
March 7, 2025 | Andy Shaughnessy, I-Connect007Estimated reading time: 2 minutes
It’s been a busy week. My must-reads include articles and news items on global trends and challenges, groundbreaking technology, the hunt for the elusive young PCB designers, and some personnel changes. We also have a great column on the value of following up and keeping promises. We’re all guilty of “dropping the ball” from time to time, aren’t we? So, how do you recover?
IPC APEX EXPO takes place in Anaheim, California, March 18-20, and we’ll be there from ribbon-cutting through the final announcement telling everyone that the show is closed. We’ll be bringing you Real Time with… video interviews with the movers and shakers in PCB design, fabrication, assembly, and test. I’ll be glad to get out of Atlanta—it’s freezing here.
If you’re at the IPC show, stop by our booth and say hello. In the meantime, have a good weekend.
IMAPS’ Annual Conference Opener in Phoenix ‘Blew My Mind’
Published March 5
PCB007 Editor Marcy LaRont brings us this review of the first day’s events at the IMAPS Device Packaging Conference in Phoenix this week. As she explains, there was a lot of attention paid to AI and advanced packaging substrates, including glass. I understand the appeal of glass at the packaging level. I’ve heard some PCB fabricators discuss using glass; has anyone on the PCB side ever utilized glass?
UHDI Fundamentals: UHDI Advances Neurotechnology
Published March 5
If you’ve been following Anaya Vardya’s UHDI series, you’re aware that his new technology is a real game-changer. In this installment, Anaya explains how UHDI figures into the development of neurotechnology, especially brain-computer interfaces (BCI). It’s a brave new world for UHDI, and the innovation is only getting started.
Summit Interconnect Announces Key Executive Appointments: Sean Patterson Named CTO, Michael Norman Joins as President and COO
Published March 6
Summit Interconnect has new leadership now, with COO Sean Patterson becoming the company’s first CTO. Michael Norman joins Summit from Raytheon, becoming president and COO. Shane Whiteside will continue as CEO and chairman of the board.
It’s Only Common Sense: Follow Through and Keep Your Promises
Published March 3
Dan Beaulieu really nails it this week: We work in a blizzard of emails and texts, so following up is a real necessity. There’s really no excuse for failing to follow up, and we’re all guilty of this at one time or another. But we all know which of our friends, customers, and suppliers are the most likely to follow up, and they’re the ones we tend to want to deal with. Dan says, “Following through on promises isn’t a common trait.” I’d like to disagree, but he may be right. Check it out.
Recruiting the Next Generation of PCB Designers at Garmin
Published March 6
It’s no secret that we’re running out of PCB designers and design engineers. There are open PCB design jobs around the globe, and there aren’t enough designers to fill these jobs. In this interview, Garmin’s design engineering manager, LB Yates, explains the company’s plans to recruit and train the next generation of PCB designers.
Share on:
Suggested Items
IPC Strengthens Electronics Industry Awareness with Appointment of Carrie Sessine as Global Communications Vice President
04/16/2025 | IPCIPC, the global electronics association, announces the strategic appointment of Carrie Sessine as vice president of global communications. This newly created executive position underscores the association’s commitment to championing the electronics industry's critical contributions to global innovation and economic growth.
Real Time with... IPC APEX EXPO 2025: Emerging Trends in Design and Technology
04/16/2025 | Real Time with...IPC APEX EXPOAndy Shaughnessy speaks with IPC design instructor Kris Moyer to discuss emerging design trends. They cover UHDI technology, 3D printing, and optical data transmission, emphasizing the importance of a skilled workforce. The role of AI in design is highlighted, along with the need for understanding physics and mechanics as designs become more complex. The conversation concludes with a focus on enhancing math skills for better signal integrity.
Real Time with... IPC APEX EXPO 2025: EPOCH Expands With Automation
04/17/2025 | Real Time with...IPC APEX EXPOWith a 35-year history, EPOCH is expanding its operations in Bangalore, India, focusing on automation and customer collaboration. Phil Marcoux leads a task force for AI in PCB design, working with various companies to enhance collaboration, and cites that, historically, data sharing has provided the greatest challenge for AI development. Luckily, he says, that is changing. EPOCH combines AI and traditional methods in manufacturing, especially in product design.
Real Time with... IPC APEX EXPO 2025: Transition Automation Focusing on Security Coatings and Squeegee Technology
04/16/2025 | Real Time with...IPC APEX EXPOMark Curtin, President of Transition Automation, gives an update on recent innovations at his company. He highlights a record sales month and their new focus on security coatings to fight counterfeiting. Mark explains the engineering behind their durable squeegees, the importance of maintenance, and the value of considering overall costs over just price.
Elephantech: For a Greener Tomorrow
04/16/2025 | Marcy LaRont, PCB007 MagazineNobuhiko Okamoto is the global sales and marketing manager for Elephantech Inc., a Japanese startup with a vision to make electronics more sustainable. The company is developing a metal inkjet technology that can print directly on the substrate and then give it a copper thickness by plating. In this interview, he discusses this novel technology's environmental advantages, as well as its potential benefits for the PCB manufacturing and semiconductor packaging segments.