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BEST Inc. Reports Record Demand for EZReball BGA Reballing Process

05/01/2025 | BEST Inc.
BEST Inc., a leader in electronic component services, is pleased to announce they are experiencing record demand for their EZReball™ BGA reballing process which greatly simplifies the reballing of ball grid array (BGA) and chip scale package (CSP) devices.

HyRel Announces Sale of First Versacell Robotic System to Leading Defense Contractor

12/03/2024 | HyRel
HyRel Technologies, a global provider of quick-turn semiconductor modification solutions, is proud to announce the sale of its first Versacell Robotic Solder Dip & BGA Reballing System to one of the top five defense contractors. Originally developed for internal use, the revolutionary Versacell System drew the attention of the contractor, who recognized its impressive precision, accuracy, and efficiency.

PDR Rework Systems Announces New Integrated Reball System for Rework

08/24/2022 | PDR Rework Systems
PDR, a leading manufacturer of BGA rework systems, test and X-ray inspection systems since 1985, announced the release of the firm’s new integrated Reballing system for all PDR Evolution Series Rework Systems.

Accurate Circuit Engineering Expands Services with Addition of Assembly

02/23/2016 | Accurate Circuit Engineering (ACE)
Accurate Circuit Engineering (ACE) has officially added assembly to their already extensive list of expert PCB services. In an increasingly competitive market ACE understands the need to offer a complete manufacturing solution to their customers.
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