Happy’s Tech Talk #29: Bend-to-Install Semi-flex FR-4
BEST Inc. Reports Record Demand for EZReball BGA Reballing Process
May 1, 2025 | BEST Inc.Estimated reading time: 1 minute
BEST Inc., a leader in electronic component services, is pleased to announce they are experiencing record demand for their EZReball™ BGA reballing process which greatly simplifies the reballing of ball grid array (BGA) and chip scale package (CSP) devices.
BEST’s EZReball™ is a reballing preform that consists of an array of solder spheres positioned with a high-temperature polyimide stencil and an adhesive-backed carrier to hold the solder balls in their precise location. These preforms can be made quickly without tooling charges in almost any possible array pattern, including various solder alloys, lead pitches, and ball diameters.
Our EZReball™ preforms are simple and easy-to-use for reballing BGAs. BEST’s EZReball preforms are manufactured from a specialty high temperature-rated film which aligns the balls with the corresponding array. The preforms are cut using a precision laser to meet exacting device requirements. Solder balls are captured and retained by the preform and are aligned to the prepped BGA device and reflowed. After reflowing the preform is simply peeled away. EZReball™ performs can be used on the smallest pitch CSPs and BGAs with pitches down to 0.35mm and ball sizes down to 6 mils.
A significant benefit of the EZReball™ process is that the reballing preforms will accurately place a new array of solder balls relying on simple physical properties rather than requiring operator dexterity or skill. With other reballing methods that use loose solder spheres you can typically process only one component at a time. Using the EZReball™ preforms, you can process several parts at the same time with only a few minutes of labor. Based on time studies of reballing 10 or more devices, EZReball™ method has shown to be 30% faster than other reballing methods using metal stencils. EZReball™ is in full compliance with the IPC 7711/21 Procedure 5.7.6. for BGA rework processes as one of the methods for reballing a BGA and allows for better yields and faster reballing times
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