-
- News
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueIt's Show Time!
In this month’s issue of PCB007 Magazine we reimagine the possibilities featuring stories all about IPC APEX EXPO 2025—covering what to look forward to, and what you don’t want to miss.
Fueling the Workforce Pipeline
We take a hard look at fueling the workforce pipeline, specifically at the early introduction of manufacturing concepts and business to young people in this issue of PCB007 Magazine.
Inner Layer Precision & Yields
In this issue, we examine the critical nature of building precisions into your inner layers and assessing their pass/fail status as early as possible. Whether it’s using automation to cut down on handling issues, identifying defects earlier, or replacing an old line...
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - pcb007 Magazine
WISE Partners with TTM Technologies for Syracuse uHDI Manufacturing Facility
March 4, 2025 | TTM Technologies, Inc.Estimated reading time: 1 minute
TTM Technologies (“TTM”) has selected WISE as a key partner and exclusive supplier of horizontal wet process machines for its new ultra-high-density interconnect (“uHDI”) PCB manufacturing facility in Syracuse, NY.
This cutting-edge facility, adjacent to TTM’s existing campus, represents a major investment in North American high-tech manufacturing. With a projected capital investment of $100-$130 million, the project will generate approximately 400 skilled jobs in manufacturing and engineering.
WISE will provide 15 advanced wet and mechanical process machines, ensuring optimized PCB production and reinforcing its long-standing partnership with TTM. WISE’s strong presence in the U.S., supported by its trusted partners Technica USA and Photo Chemical Systems, played a crucial role in this agreement.
In addition to providing state-of-the-art equipment, WISE offers outstanding support through two strategically stocked spare parts inventories in the USA territory and a team of 10 factory-trained technicians across the U.S. This strong service network ensures fast response times and dependable maintenance for TTM’s operations.
Phil Titterton, Executive Vice President and Chief Operating Officer of TTM Technologies, stated, “WISE’s expertise and strong U.S. support system make them a key partner in achieving our manufacturing goals.”
Massimo Passerini, Chief Executive Officer of WISE, added, “We are proud to contribute to TTM’s growth with our cutting-edge technology and dedicated service network.”
This partnership strengthens domestic PCB production, advancing high-tech manufacturing and reinforcing WISE’s commitment to excellence in the U.S. market.
Suggested Items
Jabil Announces Expansion into Gujarat
03/06/2025 | JabilJabil Inc., a global leader in engineering, supply chain, and manufacturing solutions, announced that it will open a new factory in Gujarat, its second in the country.
Cicor Bids to Acquire Part of Éolane France
03/06/2025 | CicorCicor Group announces that the discussions with the company Éolane France and relevant governmental authorities regarding a potential acquisition of selected Éolane France businesses, as mentioned in Cicor's media statement of 22 January 2025, have reached an advanced stage. A public offer has been submitted.
MicroCare to Debut Advanced Cleaning and Lubrication Solutions at IPC APEX 2025
03/06/2025 | MicroCare Corp.MicroCare, a global leader in critical cleaning and coating solutions, is excited to announce its participation in the IPC APEX Expo 2025, taking place from March 18-20 at the Anaheim Convention Center in California.
Connect the Dots: Designing for Reality—Routing, Final Fab, and QC
03/06/2025 | Matt Stevenson -- Column: Connect the DotsIn the previous episode of I-Connect007’s On the Line with… podcast, we discussed several commonly used surface finishes, laying out the unique properties, the application process, and the associated pros and cons. Our final steps in the manufacturing process include routing, final inspection, and shipment.
Drip by Drip: Semiconductor Water Management Innovations
03/05/2025 | IDTechExNot only does semiconductor manufacturing require large volumes of energy, chemicals, and silicon wafers, it also requires vast volumes of water. IDTechEx’s latest report, “Sustainable Electronics and Semiconductor Manufacturing 2025-2035: Players, Markets, Forecasts”, forecasts water usage across semiconductor manufacturing to double by 2035, as demand for integrated circuits continues to rise.