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Current IssueThe Hole Truth: Via Integrity in an HDI World
From the drilled hole to registration across multiple sequential lamination cycles, to the quality of your copper plating, via reliability in an HDI world is becoming an ever-greater challenge. This month we look at “The Hole Truth,” from creating the “perfect” via to how you can assure via quality and reliability, the first time, every time.
In Pursuit of Perfection: Defect Reduction
For bare PCB board fabrication, defect reduction is a critical aspect of a company's bottom line profitability. In this issue, we examine how imaging, etching, and plating processes can provide information and insight into reducing defects and increasing yields.
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We take the pulse of the PCB industry by sharing insights from leading fabricators and suppliers in this month's issue. We've gathered their thoughts on the new U.S. administration, spending, the war in Ukraine, and their most pressing needs. It’s an eye-opening and enlightening look behind the curtain.
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I-Connect007 Editor’s Choice: Five Must-Reads for the Week
February 14, 2025 | Andy Shaughnessy, Design007 MagazineEstimated reading time: 2 minutes

Show season is upon us. Recently, Marcy LaRont and I attended DesignCon’s 30th anniversary show, and the expo floor was packed for almost the entire time. Show managers went all out, hosting a welcome party that included a rocking DJ. Much of the event revolved around AI and how to implement it. Is your company utilizing AI now?
Some of the engineers I met with have attended every DesignCon over the past 30 years, which is a great testimonial to the show’s longevity. Coming soon, we are headed to IPC APEX EXPO (the 25th anniversary of that event) and PCB East. You can look here for the industry’s best show coverage.
I’m featuring an abundance of articles from the past week, covering everything from DesignCon presentations to the benefits of volunteering for an IPC committee. If you’ve ever thought about joining a relevant committee, IPC is always looking for “new blood.”
See you again in a few weeks!
Here’s Looking at You, Kid
Published February 13
We’re in the middle of a PCB designer shortage, and it’s likely to get worse before it gets better. We need thousands of young PCB designers and design engineers. Where are we going to find them, and how are we going to train them when we do find them? We asked design instructors Kris Moyer and John Watson to weigh in, and, as usual, they had plenty of great ideas.
Facing the Future: The Evolution of the North American PCB Industry
Published February 12
Prashant Patel, the founder of Alpha Circuit, is one of our newest columnists. He brings us a great overview of the evolution of the North American PCB industry. As he points out, despite the shrinking number of board shops here, this region has quite a few positive things going for it, with resilience and reinvention topping the list.
Happy Holden: How I Became an Engineer
Published February 11
Somehow, I always thought that Happy Holden came from a family of scientists. But as Happy explains in this interview with Marcy LaRont, his father was a dairy farmer, and his mother was a chemist on the Manhattan Project. He’s always an interesting interview. Check it out.
Managing Energy Flow with Proper Stackup Design
Published February 13
Managing a PCB’s energy flow can be a delicate dance, and the stackup can play a big role here. In this interview, Dan Beeker recaps his DesignCon presentation, explaining how thoughtful stackup design can help designers conduct energy where they want it to go, and away from where they don’t want it.
The Secret Value of Committee Work
Published February 12
If you’ve always wondered what happens in IPC committees, you won’t want to miss this interview with Teresa Rowe, the head of standards and practices at IPC. Teresa explains the “secret value” of volunteering to work on these committees; as she says, “standards committee work is not for everyone,” but it might be just what you’re looking for.
Suggested Items
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
06/20/2025 | Andy Shaughnessy, I-Connect007It’s been a busy week in this industry, and we have news and articles from the PCB design, fabrication and assembly communities. Some of this news is out of this world. We may be losing the high ground—the really high ground. Columnist Jesse Vaughan explains how the U.S. seems to be falling behind in space, and how this could affect our ability to defend ourselves in the future. We have an update on the U.S.-China tariff talks, which seem to be moving forward, though sometimes at a snail’s pace.
All Flex Solutions Upgrades Lamination Layup
06/19/2025 | All Flex SolutionsAll Flex Solutions has invested in Ulrich Rotte lamination layup stations in their rigid flex layup area. The Ulrich Rotte stations automate the layup process by handling the lamination plates, which are heavy, and sequencing the layup process for the operators.
'Air Sovereignty' for AT&S: Gold Status Underpins Highest Aerospace Competence in Leoben
06/19/2025 | AT&SThe systems that control modern aircraft are subject to the strictest requirements in the electronics industry. Suppliers to aviation companies must therefore have their production facilities and processes inspected annually by independent auditors as part of the National Aerospace and Defense Contractors Accreditation Program (Nadcap).
Felix Martinez Promoted to Insulectro VP of Operations
06/19/2025 | InsulectroInsulectro is pleased to announce the internal promotion of Felix Martinez to Vice President of Operations.
The Evolution of Picosecond Laser Drilling
06/19/2025 | Marcy LaRont, PCB007 MagazineIs it hard to imagine a single laser pulse reduced not only from nanoseconds to picoseconds in its pulse duration, but even to femtoseconds? Well, buckle up because it seems we are there. In this interview, Dr. Stefan Rung, technical director of laser machines at Schmoll Maschinen GmbH, traces the technology trajectory of the laser drill from the CO2 laser to cutting-edge picosecond and hybrid laser drilling systems, highlighting the benefits and limitations of each method, and demonstrating how laser innovations are shaping the future of PCB fabrication.