-
- News
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueSales: From Pitch to PO
From the first cold call to finally receiving that first purchase order, the July PCB007 Magazine breaks down some critical parts of the sales stack. To up your sales game, read on!
The Hole Truth: Via Integrity in an HDI World
From the drilled hole to registration across multiple sequential lamination cycles, to the quality of your copper plating, via reliability in an HDI world is becoming an ever-greater challenge. This month we look at “The Hole Truth,” from creating the “perfect” via to how you can assure via quality and reliability, the first time, every time.
In Pursuit of Perfection: Defect Reduction
For bare PCB board fabrication, defect reduction is a critical aspect of a company's bottom line profitability. In this issue, we examine how imaging, etching, and plating processes can provide information and insight into reducing defects and increasing yields.
- Articles
- Columns
- Links
- Media kit
||| MENU - pcb007 Magazine
LPMS USA to Offer Live Molding Demos at IPC APEX 2025
February 7, 2025 | LPMS USAEstimated reading time: Less than a minute

LPMS USA, a leader in low pressure molding solutions, is thrilled to exhibit at IPC APEX 2025. Join us at Booth #2300 for live molding demonstrations using the innovative KAPPA 1100H.
Low-pressure molding is an innovative, fast, and efficient process that encapsulates, seals, and protects electronics in a single step. Whether you need to waterproof delicate electronics, overmold cable harnesses, or safeguard LEDs, this process speeds up production, lowers environmental impact, and cuts costs compared to traditional potting methods, all while providing reliable protection for your components.
At the event, we’ll showcase the KAPPA 1100H, a compact, operator-friendly machine that prioritizes safety and ease of use. This machine highlights our commitment to delivering high-quality, reliable solutions tailored to meet the demands of modern electronics manufacturing.
Join us at Booth #2300 to explore how LPMS USA can help you streamline production and protect your products.
Testimonial
"We’re proud to call I-Connect007 a trusted partner. Their innovative approach and industry insight made our podcast collaboration a success by connecting us with the right audience and delivering real results."
Julia McCaffrey - NCAB GroupSuggested Items
ViTrox Unveils Smart 3D AOI Solutions, Pioneering Dual-Sided Inspection and Robotic Vision Solutions for Back-end Assembly Processes
08/04/2025 | ViTroxViTrox, which strives to be the World’s Most Trusted Technology Company, proudly announces the launch of its new-generation innovations in Automated Optical Inspection (AOI) technology for back-end assembly processes.
Transition Automation to Debut Sliding Paste Retainers at SMTA International
08/04/2025 | Transition Automation (TA)Transition Automation, Inc. (TA) will exhibit a new Paste Retainer option in booth 2947 at the SMTA International 2025, taking place from Oct. 21-23, 2025, at the Donald E. Stephens Convention Center in Rosemont, IL.
August 2025 SMT007 Magazine: Supply Chain Strategies
08/04/2025 | I-Connect007 Editorial TeamBelieve it or not, how you manage your supply chain has a noticeable impact on how your brand is perceived. In this issue of SMT007 Magazine, we explore the connection between supply chain practices and brand perception—and what you can do to strengthen it.
Indium Corporation Introduces New Flip-Chip Flux for Semiconductor Devices
07/31/2025 | Indium CorporationIndium Corporation, a leading materials refiner, smelter, manufacturer, and supplier, today announced the global availability of WS-910 Flip-Chip Flux, a new water-soluble flip-chip dipping flux designed to meet the demands of cutting-edge semiconductor devices.
FlashPCB Enhances SMT Production Line with Heller 1809 Reflow Oven and KIC ProBot
07/31/2025 | FlashPCBFlashPCB, a leading provider of quick-turn PCB assembly, has expanded its surface mount production capabilities with the installation of a Heller 1809 MKII reflow oven paired with the KIC ProBot automatic profiling system. This addition supports FlashPCB’s goal of achieving faster throughput, higher quality assurance, and consistent process control across a wide range of PCB builds.