The Future of Electronics Manufacturing in APAC
January 30, 2025 | Daniel Schmidt, MKS' ATOTECHEstimated reading time: 1 minute

The Asia-Pacific (APAC) region is solidifying its leadership in electronics manufacturing, fueled by significant new investments from global industry leaders. This growth is driven by surging demand for high-performance components in key sectors like AI, autonomous vehicles, and sustainable energy, making strategic innovation in semiconductors and advanced electronics essential. APAC's strong supply chains further enhance its appeal to investors.
Transforming Electronics Manufacturing
The electronics industry's shift to 3D heterogeneous integration—assembling chips on organic substrates—is driving demand for new materials, processes, and technologies. This innovation, combined with the industry's increasing presence in APAC, leverages the region's robust manufacturing capabilities and investment opportunities, positioning it for substantial growth.
Meeting the Challenges of Advanced Technologies
The rise of AI, renewable energy systems, and autonomous vehicles has created a demand for components that are faster, smaller, and capable of handling immense data loads. Essential for miniaturization and high-speed applications, next-generation technologies using electrochemical deposition for advanced semiconductor packaging, semi-additive processing (SAP) for package substrates, or modified SAP (mSAP) at the printed circuit board level enable the much finer feature sizes required for increased density and fast signaling. In addition, advanced materials such as glass substrates are contributing to this trend, enabling finer feature sizes with improved signal integrity, which is critical for high-performance systems.
Read the rest of this article in the January 2025 issue of PCB007 Magazine.
Suggested Items
US Marine Corps, L3Harris Launch First Long-Range Precision Fire in Training Range Demonstration
02/20/2025 | L3Harris TechnologiesThe U.S. Marine Corps successfully demonstrated an L3Harris Technologies solution for long-range precision fires from a vertical takeoff and landing (VTOL) platform using an AH-1Z helicopter at Yuma Proving Grounds, Arizona.
US Marine Corps, L3Harris Launch First Long-Range Precision Fire in Training Range Demonstration
02/18/2025 | L3 TechnologiesThe U.S. Marine Corps successfully demonstrated an L3Harris Technologies (NYSE: LHX) solution for long-range precision fires from a vertical takeoff and landing (VTOL) platform using an AH-1Z helicopter at Yuma Proving Grounds, Arizona. This demonstration marks the first successful engagement of a target from a VTOL platform at previously untouchable ranges.
RTX's Raytheon Completes 10 Subsystem Demonstrations for U.S. Army's Next-Generation Short-Range Interceptor Program
02/18/2025 | RTXRaytheon, an RTX business, announced a series of 10 successful subsystem demonstrations for the U.S. Army's Next-Generation Short-Range Interceptor (NGSRI), which will eventually replace the Stinger® surface-to-air missile.
Siemens to Accelerate Customer Time to Market with Advanced Silicon IP Through New Alphawave Semi Partnership
02/12/2025 | SiemensSiemens Digital Industries Software today announced that it has signed an exclusive OEM agreement for its EDA business to bring Alphawave Semi’s portfolio of high-speed interconnect silicon IP to market through its sales channel.
Strategic Materials Conference 2025 to Highlight the New Era of Materials Innovation
02/12/2025 | SEMIWith advanced materials as a critical enabler of semiconductor growth applications, the Strategic Materials Conference (SMC) 2025 will gather top executives and technology leaders from the semiconductor manufacturing industry for exclusive insights into the latest advancements in materials innovation.