-
- News
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueFueling the Workforce Pipeline
We take a hard look at fueling the workforce pipeline, specifically at the early introduction of manufacturing concepts and business to young people in this issue of PCB007 Magazine.
Inner Layer Precision & Yields
In this issue, we examine the critical nature of building precisions into your inner layers and assessing their pass/fail status as early as possible. Whether it’s using automation to cut down on handling issues, identifying defects earlier, or replacing an old line...
Engineering Economics
The real cost to manufacture a PCB encompasses everything that goes into making the product: the materials and other value-added supplies, machine and personnel costs, and most importantly, your quality. A hard look at real costs seems wholly appropriate.
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - pcb007 Magazine
Koh Young Partners with NTV USA to Expand its Advanced Packaging and Semiconductor Inspection Solutions in the United States
January 28, 2025 | Koh YoungEstimated reading time: 2 minutes
Koh Young, the global leader in True 3D measurement-based inspection and metrology solutions, is excited to announce its partnership with NTV USA (NexTex Ventures, LLC) to bring its proven inspection technologies to the semiconductor industry. With more than 24,000 systems installed worldwide, Koh Young has earned its reputation for innovation, accuracy, and reliability in the Surface Mount Technology (SMT) sector. Building on its success in SMT, Koh Young has expanded its advanced inspection and metrology solutions to the semiconductor industry, where it is already well-established in Asia. Now, through this strategic collaboration with NTV, Koh Young is making its metrology and inspection technology available to companies in the U.S. engaged in System-in-Package (SiP), Wafer-Level Packaging (WLP), die stacking, and other advanced packaging applications.
Koh Young has developed the Meister Series and ZenStar, advanced metrology and inspection solutions tailored for the semiconductor industry. These systems are purpose-built to address the demanding requirements of advanced processes:
- Meister S: Designed for inspecting SiP and advanced packaging, the Meister S delivers high-precision 3D solder paste inspection with unparalleled accuracy and repeatability, ensuring superior control and yield optimization.
- Meister D: Built to inspect die and discrete components, the Meister D offers a specialized solution for ensuring product quality and reliability in high-volume semiconductor production environments.
- Meister D+: A dedicated inspection solution combining industry-leading Moiré technology and proprietary optics for highly reflective die applications, the Meister D+ provides capabilities for micro features.
- ZenStar: Koh Young’s wafer-level metrology solution, the ZenStar, delivers wafer metrology using proprietary deep learning technology to inspect defects such as micro-cracks, foreign material, chipping, and more.
Backed by Koh Young’s award-winning support organization and NTV’s expertise, this partnership ensures companies have access to industry-leading inspection systems and local sales support to meet their most demanding requirements. Together, Koh Young and NTV are empowering the semiconductor industry with solutions designed to enhance yield, improve control, and drive innovation.
"NTV is proud to partner with Koh Young to bring its advanced metrology and inspection solutions to semiconductor customers implementing a range of Advanced Packaging technologies," said Dean Turnbaugh, President of NTV. "Koh Young's measurement and inspection technologies, proven in the SMT sector, have been enhanced and tailored to meet the unique challenges of the semiconductor industry. We are eager to introduce these solutions to the U.S. market and support semiconductor manufacturers in achieving higher precision, reliability, and efficiency in their processes."
NTV brings a portfolio of semiconductor-related equipment and decades of experience working with both small and large semiconductor equipment companies and customers across the United States. Koh Young is the latest addition to this portfolio. Together, Koh Young and NTV are well-positioned to support your advanced semiconductor manufacturing needs.
Suggested Items
Sunny Stalnaker of ASML to Receive SEMI Sales and Marketing Excellence Award
01/30/2025 | ASMLSEMI announced that Sunny Stalnaker of ASML has won the 2025 SEMI Sales and Marketing Excellence Award, inspired by Bob Graham.
SIA Applauds House Introduction of Legislation to Strengthen American Chip Manufacturing and Design
01/29/2025 | SIAThe Semiconductor Industry Association (SIA) released the following statement from SIA President and CEO John Neuffer commending the introduction in the U.S. House of Representatives of the bipartisan Semiconductor Technology Advancement and Research (STAR) Act.
iNEMI Packaging Tech Topic Webinar: Overcoming Challenges in 3D Packaging Test & Inspection
01/23/2025 | iNEMIRegister today for a free webinar on February 13th to explore emerging solutions for testing and inspecting complex 3D semiconductor packaging.
StratEdge Partners with Vitale Engineering as Manufacturer's Representative for Upstate New York
01/22/2025 | StratEdgeStratEdge Corporation, leader in the design, production, and assembly of high-frequency and high-power semiconductor packages, has appointed Vitale Engineering as its exclusive Manufacturer’s Representative for Upstate New York. Known for their customer-focused approach and technical expertise,
SIA Welcomes Trump Administration
01/22/2025 | SIAFollowing this week’s inauguration of President Trump and Vice President Vance, the Semiconductor Industry Association (SIA) released the following statement from SIA President and CEO John Neuffer welcoming the new administration.