Taiwan Earthquake Shows Shows Minimal Impact on Wafer Fabs, But Tightness in the TV Panel Supply May Worsen in 1Q25
January 21, 2025 | TrendForceEstimated reading time: 2 minutes
A magnitude 6.4 earthquake struck southern Taiwan, with its epicenter in Chiayi, at 12:17 AM on January 21, 2025. TrendForce’s preliminary assessment found that nearby wafer fabs had not suffered significant damage.
TSMC and UMC’s Tainan fabs, which experienced seismic intensity levels above 4, initiated immediate personnel evacuation and equipment shutdowns for inspections. While no critical equipment damage was reported, unavoidable debris was generated inside furnace equipment. Tainan, a key hub for panel manufacturing, may face disruptions that could exacerbate the already tight TV panel supply situation in 1Q25.
TrendForce notes that TSMC operates an 8-inch fab and two 12-inch fabs in Tainan, producing a wide range of technologies from mature nodes to advanced 5/4nm and 3nm processes. UMC runs a 12-inch fab in the region, supporting nodes from 90nm to 14nm. Operations at these facilities began resuming on the morning of January 21, with TrendForce noting that the earthquake’s impact on actual production appears to be within controllable limits.
While the Tainan fabs produce a diverse range of products, the overall utilization rate for mature processes is currently at 70–80%, reflecting the seasonal lull in component demand. This provides significant flexibility for production adjustments. For advanced nodes, TrendForce believes most current wafer starts are for inventory preparation, and the short downtime or minor debris impact can be easily mitigated. As a result, no significant disruptions are anticipated.
Tainan is home to major display manufacturer Innolux, with key facilities including Fab 2, Fab 3, Fab 5, Fab 6, and Fab 7, while nearby Kaohsiung hosts Fab 8, Fab 8b, and T6. Due to the age of some of these plants and the intensity of the earthquake, several Tainan fabs reported equipment shutdowns, with the extent of damage still under evaluation.
TrendForce warns that this event could further strain the already tight TV panel supply in 1Q25, compounding existing challenges for the display industry.
Subscribe
Stay ahead of the technologies shaping the future of electronics with our latest newsletter, Advanced Electronics Packaging Digest. Get expert insights on advanced packaging, materials, and system-level innovation, delivered straight to your inbox.
Subscribe now to stay informed, competitive, and connected.
Suggested Items
SPARK Microsystems Selected for CAD $1M in Government of Canada-backed FABrIC Funding
05/14/2026 | BUSINESS WIRESPARK Microsystems, a Canadian fabless semiconductor company specializing in next-generation short-range wireless communications, has been selected by FABrIC as a CAD $1 million grant recipient funded by the Government of Canada.
I-Connect007 Releases The Printed Circuit Designer’s Guide to… Direct Metallization: A Guide to Complex PCB Fabrication
05/15/2026 | I-Connect007As PCB complexity continues to accelerate, fabricators and OEMs are reevaluating long-standing manufacturing processes to meet the demands of AI, HDI, advanced packaging, and next-generation electronics. To address these evolving challenges, I-Connect007 is proud to announce the release of The Printed Circuit Designer’s Guide to… Direct Metallization: A Guide to Complex PCB Fabrication, authored by MacDermid Alpha Solution’s Carmichael Gugliotti.
Fabrinet Announces Q3 Fiscal Year 2026 Financial Results
05/11/2026 | FabrinetFabrinet, a leading provider of advanced optical packaging and precision optical, electro-mechanical and electronic manufacturing services to original equipment manufacturers of complex products, announced its financial results for its third fiscal quarter ended March 27, 2026.
AdvancedPCB Advances Precision Drilling Capabilities Across Two U.S. Facilities with Schmoll
05/05/2026 | AdvancedPCBAdvancedPCB has completed the installation of two Falcon small-hole drilling systems from Schmoll Maschinen GmbH at its U.S. facilities in Maple Grove, Wisconsin and Santa Clara, California.
Trouble in Your Tank: In Complex Systems, Design Rules Aren’t Optional
05/06/2026 | Michael Carano -- Column: Trouble in Your TankThere is no question that the electronics industry, especially in circuit board design and fabrication, advanced packaging, and innovation throughout the value chain, has seen a significant transformation, whether it be in materials, system architecture, HDI and ultra HDI, semiconductors, or chiplets. AI and high-performance computing (HPC) are driving change across several fronts, including material properties, assembly techniques (think hybrid bonding), and power management.